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Deals / Success Stories News
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Artel Video Systems integrates JPEG2000 Compression capabilities into DigiLink utilizing intoPIX high performance IP-cores (Tuesday Nov. 05, 2013)
At CCW, Artel Video Systems, a leading provider of broadcast-quality media transport solutions, will showcase the DigiLink video transport platform featuring high performance, low latency, HD-SDI to JPEG2000 compression with MPEG-2 TS and DVB-ASI encapsulation. The demonstration highlights the partnership with intoPIX, a leading provider of FPGA-based JPEG2000 solutions.
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Toumaz Licenses compact configuration of Barco Silex's Public Key IP (BA414E) in its ultra-low power wireless IC for its healthcare product (Wednesday Oct. 30, 2013)
Barco Silex announced today that Toumaz has successfully integrated Barco Silex Public Key IP core (BA414E) into its ultra-low power wireless communication ASIC.
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Access Network Technology Leverages Arteris FlexNoC for New Mobile LTE Modem Chip (Wednesday Oct. 30, 2013)
Arteris today announced that Access Network Technology Limited has licensed the Arteris® FlexNoC® interconnect IP fabric for use in its newest mobile LTE modem baseband chip.
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Sidense Advanced Process Node 1T-OTP to be used in Sigma Designs DTV Products (Tuesday Oct. 29, 2013)
Sidense today announced that Sigma Designs has selected Sidense 1T-Fuse™-based 1T-OTP memory IP for use in their next generation DTV and home entertainment product lines.
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IC-LOGIC Debuts "First Time Right" Chip with Arteris FlexNoC and C2C Interconnect IP for Automotive and Industrial Applications (Tuesday Oct. 29, 2013)
Arteris and IC-LOGIC GmbH today announced that the IC-LOGIC IO HUB chip will be deployed into automobiles beginning 2015. IO HUB leverages Arteris® FlexNoC® network on chip interconnect IP and C2C chip-to-chip interconnect IP for systems-on-chip.
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Aliathon Announcing NEC as a Communications Segment Client (Monday Oct. 28, 2013)
Aliathon Ltd. today are delighted to announce that NEC Corporation have committed to using an Aliathon FPGA solution in their next generation CX2800 multi-service transport switch.
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IBM licenses new ARM technology for custom chips aimed at networking, communications (Friday Oct. 25, 2013)
IBM today announced that it has licensed a broad range of ARM® Cortex® processors from ARM Holdings. IBM plans to offer the new microprocessors to its custom-chip clients; leading companies that build network routers, switches and the cellular base stations that enable pervasive wired and wireless communications across the globe.
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Spreadtrum Selects ARM Artisan Physical IP and POP IP for 28nm SoC Development (Thursday Oct. 24, 2013)
ARM and Spreadtrum today announced a sweeping license agreement providing Spreadtrum with the full range of ARM® Artisan® physical IP, including POP™ IP, for the broad range of IC foundry and process varieties of 28nm that ARM supports to deliver the most flexible manufacturing options.
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VIA Technologies Licenses Cadence Tensilica HiFi Audio/Voice DSP (Monday Oct. 21, 2013)
Cadence today announced that Taiwan-based VIA Technologies has selected the Cadence(R) Tensilica(R) HiFi Audio/Voice DSP for a SOC design for set top box, tablets and mobile devices.
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Nintendo 2DS Adopts DMP's graphics IP core (Monday Oct. 14, 2013)
Digital Media Professionals Inc(DMP) today announced that DMP’s graphics IP core, PICA200, is used in Nintendo's “Nintendo 2DS” which will launch on October 12 in North America, Europe and Australia.
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Mediatek Extends Partnership with ARM to Drive Next-Generation Mobile and Consumer Technology (Tuesday Oct. 08, 2013)
ARM and MediaTek announced today that MediaTek has acquired a broad license to Cortex-A50 Series processor cores and the next generation of ARM Mali graphics processing Unit (GPU) solutions
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EnSilica and Kili Technology collaboration delivers FIPS-compliant secure processor IC (Tuesday Oct. 08, 2013)
EnSilica has announced that it has successfully collaborated with Kili Technology Corporation of Canada on the development of the Kili 3.1 FIPS 140-2 Level 3 (Federal Information Processing Standard) compliant secure processor IC
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GEO Deploys Mixel MIPI solution in its Geometric Processing IC for Ultra-Wide Angle Cameras (Tuesday Oct. 01, 2013)
Mixel announced today that GEO Semiconductor has licensed multiple Mixel MIPI® IP, successfully incorporated the IP into its innovative product, and is moving forward to volume production.
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Rambus Expands Agreement with Freescale Semiconductor (Tuesday Sep. 24, 2013)
The agreement extends Freescale’s access to Rambus’ innovations for memory controllers and serial links. Additionally, the expanded agreement provides Freescale with the ability to collaborate on Rambus’ resistive memory technology for embedded applications (eRRAM).
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Microsemi Licenses Secure Semiconductor Design Intellectual Property from Cryptography Research (Thursday Sep. 19, 2013)
CRI to Provide Microsemi with Access to its Secure Semiconductor IP Design Tools For Use in Certain Government Applications
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Spansion Licenses ARM Processor Technology to Power Embedded Systems for Automotive, Industrial and Consumer Applications (Tuesday Sep. 17, 2013)
Spansion today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.
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MediaTek and Imagination significantly expand strategic partnership (Friday Sep. 13, 2013)
Imagination Technologies has signed a further license agreement with MediaTek. The multi-year agreement includes multiple cores from Imagination’s PowerVR Series6 ‘Rogue’ family and beyond.
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Cryptography Research and ALi Corporation Sign Architecture License Agreement for DPA Countermeasures (Wednesday Sep. 11, 2013)
Cryptography Research and ALi Corporation today announced they have signed an architecture license agreement for the use of Cryptography Research’s differential power analysis (DPA) countermeasure patents and technologies in ALi’sSTBsolutions.
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HDL Design House MIPI CSI-2 TX IP core successfully integrated into Fujitsu APIX Companion Chip (Wednesday Sep. 11, 2013)
HDL Design House today announced that its MIPI CSI-2 Transmitter (HIP 3900) digital IP core, compliant with the MIPI Alliance CSI-2 Specification, has been successfully integrated into Fujitsu Semiconductor Europe GmbH's APIX® Companion Chip.
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Sidense OTP Preferred by MV Silicon for their Audio Device ICs (Monday Sep. 09, 2013)
Sidense today announced that MV Silicon has chosen Sidense 1T-Fuse™-based 1T-OTP memory IP for use in its ICs for processing, conversion and amplification in audio devices.
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Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica Hifi Audio/Voice DSP IP (Monday Sep. 09, 2013)
Dialog Semiconductor announced today that it has licenced Tensilica® HiFi Audio/Voice DSP IP from Cadence. Dialog will initially deploy the IP to develop next-generation audio solutions for its connectivity products.
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HashFast and Uniquify Announce Tape Out of "Golden Nonce" Bitcoin Network Transaction Verification Chip to TSMC's 28HPM Process (Friday Sep. 06, 2013)
HashFast Technologies and design and manufacturing operations partner Uniquify today confirmed that HashFast’s Golden Nonce (GN) Bitcoin network transaction verification Application Specific Integrated Circuit (ASIC) has successfully taped out on TSMC’s 28HPM process.
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Philips ensures customers lose the wires but not the audio quality with aptX (Thursday Sep. 05, 2013)
CSR plc today announces that its aptX® audio compression codec has been chosen by Philips to ensure high-quality Bluetooth® stereo audio in a range of its wireless audio devices.
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RivieraWaves Announces its Wi-Fi Partnership with Celeno (Monday Sep. 02, 2013)
RivieraWaves today announced an agreement to partner with Celeno Communications, a leading provider of high-performance Wi-Fi chips and software. The partnership will enable RivieraWaves and Celeno to jointly develop advanced Wi-Fi technology to address various market segments. In 2012, over 1.5 billion Wi-Fi enabled devices were shipped worldwide.
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Sidense OTP Helps Richtek Technology Give Customers Cost-Effective and Efficient Power Management Solutions (Thursday Aug. 29, 2013)
Sidense today announced that Richtek Technology has selected Sidense 1T-Fuse™-based 1T-OTP memory IP for its Power Management IC (PMIC) products.
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Imagination welcomes MediaTek's innovation in true Heterogeneous Multi-Processing with new SoC featuring PowerVR Series6 GPU (Thursday Aug. 29, 2013)
Imagination Technologies recognizes its partner MediaTek Inc. for its unique deployment of heterogeneous processing. Confirmed by leading industry sources, Imagination sees the company’s new MT8135 SoC as the industry’s first publicly announced mobile SoC enabling heterogeneous multi-processing (HMP) utilizing asymmetric processor configurations.
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Ineda unites range of low-power Imagination IP in platforms for wearables and other emerging applications (Thursday Aug. 29, 2013)
Imagination Technologies and Ineda are revealing details of Ineda’s soon-to-be-released Wearable Processor Unit (WPU) SoCs that unite various combinations of Imagination IP cores in their ultra-low power design.
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Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip (Wednesday Aug. 28, 2013)
Cadence today announced that as part of their Smart Society initiative, Renesas Electronics Corporation has licensed the Tensilica ConnX D2 DSP for a next-generation chip designed for Internet of Things (IoT) applications.
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INSIDE Secure and Solacia Team Up to Bring TrustZone-ready DRM Technology to Telechips for Secure Set-Top Boxes (Tuesday Aug. 27, 2013)
INSIDE Secure today announced that Korea-based fabless semiconductor maker Telechips has embedded the INSIDE DRM Fusion™ Agent solutions for high-bandwidth digital content protection (HDCP) and digital transmission content protection (DTCP-IP) into its newest TCC892X family of set-top box multimedia application processors.
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Vivante Continues Mass Market Momentum with the Marvell ARMADA 1500-mini Design Win (Tuesday Aug. 27, 2013)
Vivante Corporation today announced its GC1000 powers the revolutionary Marvell® ARMADA® 1500-mini multi-screen solution.








