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Fabless / IDM News

• ASIX Releases the World's First Single-Chip USB 3.0 to Gigabit Ethernet Controller (Monday Jan. 02, 2012)
  ASIX Electronics Corp., a fabless semiconductor company for embedded networking/bridging solutions, announced today the AX88179, the world’s first USB 3.0 to Gigabit Ethernet controller which integrates USB 3.0 PHY and 10/100/1000Mbps Gigabit Ethernet MAC/PHY in a single chip.
  
  
• Genesys Logic Announced the World's First USB 3.0 Webcam Controller GL3620 (Tuesday Dec. 27, 2011)
  Genesys Logic today announced its world first USB3.0 Isochronous webcam controller chip GL3620. The availability of GL3620 answers the requests for 5.0Gbps USB 3.0 Isochronous applications.
  
  
• LSI Announces Industry's First 28nm Read Channel for Hard Disk Drive Manufacturers (Thursday Dec. 22, 2011)
  LSI Corporation today announced that it is demonstrating to OEM customers the TrueStore® RC5100 read channel for hard disk drives (HDD).
  
  
• Onkyo and Silicon Image Announce the World's First A/V Receivers Featuring InstaPrevue and MHL Technologies (Thursday Dec. 22, 2011)
  Silicon Image and Onkyo today announced the world's first line of Audio/Video Receivers (AVRs) featuring Silicon Image's InstaPrevue™ technology and MHL™ (Mobile High-Definition Link) technology.
  
  
• Broadcom Announces Industry's First CMOS 40G PHY for Long Haul Optical Transport (Wednesday Dec. 21, 2011)
  Broadcom today announced its next generation 40G physical layer transceiver (PHY) chipset, designed to address the need for higher bandwidth and lower power in Optical Transport Networks (OTN).
  
  
• K-micro samples new Frame Rate Converter LCD Timing Controller for large-size LCD TV market (Wednesday Dec. 14, 2011)
  Kawasaki Microelectronics has released samples of its new Frame Rate Converter LCD Timing Controller product (FRC T-Con), dubbed VFRC-A1, for the large-size LCD TV market. Mass production will begin in Q2, 2012.
  
  
• e2v and SP Devices working together to deliver the ultimate in high-performance ADC solutions (Tuesday Dec. 13, 2011)
  e2v and SP Devices today announced their collaboration in the provision of high-performance Analogue-to-Digital (ADC) solutions.
  
  
• Triad Semiconductor Introduces the World's Smallest High Voltage Via Configurable Array (Thursday Dec. 08, 2011)
  Triad’s newest via configurable array, VCA-12, packs 3,900 mixed-signal resources into a die that can easily fit into small SOIC and QFN packages for size and price sensitive applications
  
  
• Intel, Micron Extend NAND Flash Technology Leadership With Introduction of World's First 128Gb NAND Device and Mass Production of 64Gb 20nm NAND (Wednesday Dec. 07, 2011)
  The new 20nm 128Gb MLC NAND device doubles the storage capacity and performance of the companies' existing 20nm 64Gb NAND device.
  
  
• Renesas Electronics Receives USB-IF Certification for its USB 3.0-SATA3 Bridge System-on-Chip (Tuesday Dec. 06, 2011)
  Renesas Electronics today announced that its SuperSpeed USB (USB 3.0) SATA3 bridge system-on-chip (SoC), part number, µPD720230, has passed the certification testing by the USB Implementers Forum (USB-IF).
  
  
• PLX Technology Expands 10GBase-T PHY Family; Lowers Power, Cost; Adds Powerful Features (Monday Dec. 05, 2011)
  PLX Technology today announced the expansion of its TeraPHY(R) 10GBase-T PHY family with three new single-, dual- and quad-port integrated transceivers. Designed on a 40-nanometer lithography node, these devices represent the fourth generation of PLX(R) 10GBase-T PHYs and its second generation in 40nm.
  
  
• SiliconBlue Chips Selected for New Citizen Eco-Drive Watch (Monday Dec. 05, 2011)
  SiliconBlue® Technologies today announced that Citizen Watch, the largest watchmaker and a leader in advanced watch technology, has selected SiliconBlue’s iCE65L08 device to be used in their new Eco-Drive Satellite Wave watch, the world’s first light-powered GPS-synchronized watch.
  
  
• Aptina Announces Native 1080p System on Chip Solution for High Definition Video Imaging Applications (Wednesday Nov. 30, 2011)
  Aptina today announced the AS0260 SOC (system on chip) imaging solution. The 2-megapixel native 1080p SOC delivers exceptional performance, and meets strict form factor requirements (z-height less than 3.5mm) for ultra-thin, full HD video applications within the video-centric consumer electronics market.
  
  
• New Technology for Device-Level Ethernet Guarantees Reliable, Real-Time Performance Under All Network Traffic Conditions (Monday Nov. 28, 2011)
  Innovasic Semiconductor announces PriorityChannel™, a new technology for device-level Ethernet that is designed to ensure real-time Industrial Ethernet messages are always processed on-time, every time regardless of the amount or type of other network traffic.
  
  
• Renesas Electronics Corporation Expands Lineup of Ethernet PHY Chips with Two Single-Channel Industrial Ethernet PHY Chips (Thursday Nov. 24, 2011)
  Renesas Electronics today announced the availability of two single-channel Ethernet physical layer (PHY, part number µPD60610GA-GAM-AX and µPD60611GA-GAM-AX) devices for industrial communication systems.
  
  
• SMSC Launches Industry's First, Hi-Speed Inter-Chip USB 2.0 to 10/100 Ethernet Controller for Low Power Applications (Monday Nov. 21, 2011)
  SMSC today introduced its LAN9730, the industry's first fully integrated Hi-Speed Inter-Chip (HSIC) USB 2.0 to-10/100 Ethernet device.
  
  
• SMSC Announces Industry's First High Speed Inter-Chip USB 2.0 Hub for Portable Consumer Electronics Applications (Wednesday Nov. 16, 2011)
  SMSC today announced its latest advance in High Speed Inter-Chip (HSIC) USB 2.0 connectivity, the USB3503. This Hi-Speed USB Portable Hub Controller designed around the low power and low cost HSIC interface uses SMSC’s patented Inter-Chip Connectivity™ (ICC) technology to offer a compelling USB connectivity solution for portable battery powered applications.
  
  
• Quantenna Launches World's First 802.11ac Gigabit-Wireless Solution for Retail Wi-Fi Routers and Consumer Electronics (Tuesday Nov. 15, 2011)
  New 802.11ac Solution Builds on 4x4 MIMO Foundation to Enable 2 Gbps Wireless Routers; Reference Designs Available Now for Early Customer Engagements
  
  
• NXP Develops Automotive Ethernet Transceivers for In-Vehicle Networks (Monday Nov. 14, 2011)
  NXP Semiconductors today announced its engagement in automotive Ethernet as the first automotive semiconductor supplier to license Broadcom's BroadR-Reach(R) Ethernet technology for in-vehicle networking.
  
  
• Calxeda Launches the EnergyCore Processor; Delivers 10 Times the Performance for the Same Power (Wednesday Nov. 02, 2011)
  Calxeda today unveiled its ARM-based “EnergyCore” Server-on-a-Chip, which consumes as little as 1.5 watts, the industry’s first server processor to achieve this milestone.
  
  
• Triad Semiconductor Introduces Three New Configurable High Voltage Mixed Signal ASICs (Tuesday Oct. 25, 2011)
  Triad Semiconductor today announced the availability of a family of three new high-voltage via configurable arrays (VCAs). The new arrays, VCA-9, VCA-10, and VCA-11 enable the integration of high voltage analog, precision low voltage devices, digital functions and memory blocks into inexpensive single chip solutions.
  
  
• Sequans Unveils Next-Generation FDD and TDD LTE Chips and Global LTE Platforms (Thursday Oct. 20, 2011)
  Sequans today introduced three new FDD and TDD LTE baseband chips, a companion RF chip, and two new LTE platforms, supporting all global FDD and TDD LTE networks.
  
  
• Nuvoton Introduces First Audio SoC with ARM Technology (Monday Oct. 10, 2011)
  Nuvoton today introduced the ChipCorder® ISD9160 system-on-a-chip (SoC) device, the industry’s first ChipCorder to feature a 32-bit ARM® Cortex™-M0 microcontroller core.
  
  
• Quantenna Announces Strategic Partnership with Samsung Electronics to Develop Next-Generation Wireless Products (Tuesday Oct. 04, 2011)
  Quantenna Communications announced today an agreement to partner with Samsung Electronics Co., Ltd. to develop products based on Quantenna's 4x4 MIMO Wi-Fi technology.
  
  
• Adapteva Announces 28nm 64-Core Epiphany-IV Microprocessor Chip (Tuesday Oct. 04, 2011)
  Adapteva today announced the release of the fourth generation of its Epiphany multicore architecture IP -- a 28nm design with 64 independent high-performance RISC cores on a single chip.
  
  
• Ensphere's Shipments of Thunderbolt (Optical) Chips Exceeded 500k in 2011 (Monday Oct. 03, 2011)
  Ensphere Solutions today announced that the shipments of ESI-XVR10100 have exceeded 500k devices in 2011. This product is a dual 10G transceiver device targeting the optical modules intended for the optical version of Thunderbolt (previously codenamed as “Light Peak”).
  
  
• Cavium Unveils OCTEON Fusion: Industry's Most Powerful "Base Station-on-a-Chip" Family (Monday Oct. 03, 2011)
  Cavium today unveiled the OCTEON Fusion™ Family, the industry’s most powerful, small cell “Base Station-on-a-chip” family specifically designed for LTE & 3G small cell base stations, including picocell and micro base stations.
  
  
• Silicon Image Introduces New Family of MHL Transmitters with Integrated High-Speed Switch and Support for MIPI DSI Interface (Friday Sep. 30, 2011)
  Silicon Image today announced the availability of three new MHL™ (Mobile High-Definition Link) transmitters, the SiI8332 and SiI8336 supporting the MIPI DSI interface, and the SiI8334 supporting HDMI® (High-Definition Multimedia Interface).
  
  
• Samsung Develops Industry's First LPDDR3 DRAM, Using 30nm-class Process Technology (Friday Sep. 30, 2011)
  Samsung Electronics announced today that it has developed the industry’s first monolithic four gigabit (Gb) LPDDR3 (low power double-data-rate 3) memory using 30 nanometer (nm) class* technology for mobile applications such as smartphones and tablet PCs
  
  
• Broadcom Announces Industry's First 40nm Single Chip HomePlug AV and IEEE 1901 Powerline Device (Tuesday Sep. 27, 2011)
  Broadcom today announced the industry's first 40nm single chip monolithic Powerline Communications (PLC) SoC that is HomePlug® AV 1.1 certified and IEEE 1901 compliant.