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Fabless / IDM News

• Renesas Electronics Announces High-Performance, High-Function Systems-on-Chip (SoC) for High-End Automotive Display Systems (Thursday Sep. 29, 2011)
  Renesas Electronics today announced the availability of the new automotive systems-on-chip (SoC), the SH7769, for high-end automotive display systems (graphics cluster, multifunction graphics display) supporting advanced human machine interfaces (HMI).
  
  
• World's First Via Configurable RF Receiver Introduced by Triad Semi and Kaben Wireless (Tuesday Sep. 27, 2011)
  Triad and Kaben announced the development of a programmable and via-configurable RF array (RF-VCA) for use in a wide variety of wireless applications.
  
  
• Ambarella A7L Enables the Next Generation of Digital Still Cameras With 1080p60 Fluid Motion Video (Monday Sep. 26, 2011)
  Ambarella has announced availability of the A7L system-on-chip (SoC), enabling the development of a new generation of HD video enabled Digital Still Cameras (DSCs). The A7L supports full 1080p HD H.264 video at 60 frames per second for fluid motion even during fast moving sports scenes and can capture up to thirty 16-megapixel still images per second.
  
  
• Elpida Develops Industry's First 25nm Process 4-Gigabit DDR3 SDRAM (Monday Sep. 26, 2011)
  Elpida today announced it had completed development of the industry's first 25-nm 4-gigabit DDR3 SDRAM. By using ultra-fine process technology the 4-gigabit DDR3 SDRAM becomes a more energy efficient chip and achieves higher productivity.
  
  
• NXP Unveils Industry's First Cortex-M0 Microcontrollers with Integrated Segment LCD Drivers (Monday Sep. 26, 2011)
  NXP today introduced the LPC11D00 and LPC12D00 series of microcontrollers – the first ARM® Cortex™-M0 microcontrollers with integrated segment LCD drivers, enabling high contrast and brightness in a single chip.
  
  
• TI delivers leading analog integration, best-in-class low power and floating-point performance in new Stellaris ARM Cortex-M4F microcontrollers (Monday Sep. 26, 2011)
  Texas Instruments today announced the new low power, floating-point Stellaris® Cortex™-M4F microcontroller generation. All of the new LM4Fx Stellaris microcontrollers provide floating point for performance headroom and best-in-class power consumption to address portability and power budgets.
  
  
• Inphi Delivers Industry's First 100 Gigabit Ethernet CMOS PHY Solutions for Next Generation 100G Line Cards (Tuesday Sep. 20, 2011)
  Inphi today announced the availability of the industry’s first, lowest power100 Gigabit Ethernet (GbE) CMOS PHY solutions that support the IEEE 802.3ba standard and target next generation high density 100G line cards.
  
  
• Silicon Line Announces Availability of the World's First MIPI M-PHY Optical Media Converter IC for Mobile Phones (Tuesday Sep. 20, 2011)
  Silicon Line today announced that it has brought to market the SL82027 and SL82017 optical media converter (OMC) ICs targeted at mobile and smart phones using the latest MIPI® Alliance based M-PHY standard.
  
  
• Gennum and Altera Demonstrate 4x25Gb/s ICs for Next-Generation 100Gb/s Networks (Tuesday Sep. 20, 2011)
  Gennum and Altera today announced they will demonstrate interoperability of Gennum's 25-28Gb/s PHY with Altera's 28Gb/s enabled Stratix V GT FPGA
  
  
• Gennum Enables Next Generation Storage and Data Communication Networks with Industry's First Integrated Chipset for 16G Fibre Channel (Monday Sep. 19, 2011)
  Gennum has expanded its portfolio by launching into mass production the industry's first 16G Fibre Channel module chipset which is also compatible with existing Fibre Channel applications, including 4-8G Fibre Channel and 10G Fibre Channel over Ethernet.
  
  
• MultiPhy Unveils World's First 100G PHY IC for the Metro Market (Monday Sep. 19, 2011)
  MultiPhy today announced the MP1100Q, a 100Gb/s DEMUX receiver chip specifically designed to meet the low-cost and low-power needs of the quickly growing 100G metro transport marketplace.
  
  
• Sequans' LTE Technology Approved by China's MIIT (Thursday Sep. 15, 2011)
  Sequans announced that its LTE semiconductor technology has been officially approved by China’s Ministry of Industry and Information Technology (MIIT), a government entity responsible for the regulation and development of China’s wireless industry.
  
  
• Renesas Electronics Introduces SuperH Microcontrollers that Combine Connectivity Functions Such as USB and System Control Capabilities on a Single Chip (Thursday Sep. 08, 2011)
  Renesas Electronics today announced the availability of the company's 6 new 32-bit microcontroller (MCU), the SH726A and SH726B, designed to lower the system cost of products, such as car and home audio systems and industrial equipment, while achieving a smaller mounting area.
  
  
• Silicon Image Introduces InstaPrevue Technology (Wednesday Sep. 07, 2011)
  Silicon Image today announced its latest innovation, InstaPrevue™ technology, which will be featured in Silicon Image digital TV (DTV) and audio/video receiver (AVR) port processors.
  
  
• Analogix Announces SlimPort Compatibility with MyDP Mobile Connectivity Standard (Wednesday Sep. 07, 2011)
  To enable true HD and 3D streaming capabilities for mobile devices, eliminate royalties and restrictions of competing display standards and provide simplicity for consumers, Analogix announced that SlimPort(TM) family of transmitter and receiver products are compatible with the proposed MyDP (Mobility DisplayPort) digital interface standard.
  
  
• Trident Announces New Generation of Advanced Set-Top Box SoCs Featuring Enhanced Performance, Security and Support for Online Content Viewing (Wednesday Sep. 07, 2011)
  Trident today unveiled a new generation of high-performance set-top box (STB) SoC designed for the worldwide satellite, cable, and IPTV markets.
  
  
• Accent Introduces Smart Meter Industry Game Changer with Advanced Chip Family (Tuesday Sep. 06, 2011)
  Accent announced today its second-generation ASMgrid™ standard product family targeted at the demanding performance needs required by Smart Meters.
  
  
• Renesas Electronics Introduces World's First USB 3.0-SATA3 Bridge SoC Supporting High-Speed UASP Protocol (Tuesday Aug. 30, 2011)
  The new SoC is the world's first USB 3.0 Bridge SoC that supports the UASP (USB Attached SCSI Protocol) protocol that significantly speeds up data throughput for large volumes of data.
  
  
• SiTune unveils low power single-die Dual/Diversity Terrestrial/Cable/Analog CMOS TV Tuner (Wednesday Aug. 24, 2011)
  STN-55T4800 is a highly integrated 50MHz-1GHz dual Tuner with small footprint that delivers best signal reception and adjacent channel rejection performance in different digital cable and Terrestrial standards.
  
  
• Arrow Electronics' Custom Logic Solutions Group Expands ARM Cortex Processor Portfolio to Deliver a Cost-Effective Range of Turnkey ASICs (Tuesday Aug. 23, 2011)
  Arrow Electronics today announced its Custom Logic Solutions group has expanded its multiyear agreement with ARM that adds additional processors to its portfolio of ARM® cores, interconnect, peripherals and supporting tools.
  
  
• eSilicon and TSMC Support Long-Lifecycle Products (Thursday Aug. 18, 2011)
  eSilicon today announced that, together with TSMC, they will provide long-life process technology support for customer products.
  
  
• Samsung Announces High-performance 512GB SSDs with Ultra-fast SATA Revision 3.0 Interface (Thursday Aug. 11, 2011)
  Samsung Electronics announced today volume production of SSDs (solid state drives) that support the Serial ATA Revision 3.0 interface with data transmissions at six gigabits per second (6Gb/s).
  
  
• ViXS Systems Introduces Turnkey Hardware and Software Blu-ray & Personal Video Recorder (PVR) Reference Design available for Set-top and Consumer Electronics Manufacturers (Monday Aug. 08, 2011)
  ViXS Systems's reference design offers customers a powerful Blu-ray PVR solution with the ability to add other features such as Multiple HD Transcoding , 3D Graphical user interfaces, live video streaming to iPAD and Tablets together with 3D TV support all on a single XCode® 4210 System on Chip (SoC).
  
  
• Nordic Semiconductor and Broadcom collaborate on Bluetooth low energy proximity fob prototype for mobile device security (Monday Aug. 08, 2011)
  Nordic Semiconductor Bluetooth low energy-powered security device communicates seamlessly with Broadcom Bluetooth v4.0 chip in first demonstration of latest Bluetooth wireless technology’s interoperability
  
  
• SMSC Introduces Industry's First 7-Port USB 3.0 Hybrid Hub Controller Family (Monday Aug. 08, 2011)
  SMSC today announced the USB553x, a family of USB 3.0 hub controllers consisting of 7-port and a 4-port offerings. These new SuperSpeed USB hubs deliver the industry's smallest footprint, "hybrid speed" configuration with an optimized BOM cost for designers of the emerging USB 3.0 ecosystem.
  
  
• Elpida Starts Industry's First DRAM Shipments of 25nm Process Technology (Thursday Aug. 04, 2011)
  The new 25nm process-generation product now being shipped is a DDR3 SDRAM with a memory capacity of 2-gigabits. A 25nm 4-gigabit DDR3 SDRAM is expected to become commercially available by the end of 2011.
  
  
• SMSC Introduces the Industry's First Programmable USB Power Controller (Tuesday Jul. 26, 2011)
  SMSC today announced it is breaking new ground in USB port power charging with the industry's first programmable USB power controller.
  
  
• Triad Semiconductor Announces 1-Million Gate Plus Analog Configurable Array (Monday Jul. 25, 2011)
  Triad Semiconductor today announced the availability of its largest configurable array to date – VCA-6.
  
  
• K-micro to sample world's first IEEE 1901 fully compliant power line communication LSI chip set (Monday Jul. 25, 2011)
  K-micro is announcing that it will be sampling the world’s first chip set that is fully compliant with the IEEE 1901 standard (dubbed the KHN13100 Chip), in August, 2011.
  
  
• Cognovo Software Defined Baseband chip released to Samsung Foundry 45nm Low Power process (Thursday Jul. 21, 2011)
  The device – based on Cognovo’s latest Modem Compute Engine (MCE) IP core, MCE160 – will enable licensees to develop soft modems in all cellular and wireless standards including WiFi, 2G, 3G, HSPA+, LTE and LTEAdvanced.