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Fabless / IDM News

• Microsemi Unveils 65-nm Embedded Flash Platform (Monday Nov. 08, 2010)
  Microsemi announced that its SOC Products Division, formerly known as Actel Corporation, today unveiled its new 65nm embedded flash platform, on which the company's next generation flash-based customizable SOCs (system-on-chips) will be built.
  
  
• Avago Technologies First to 28-Gbps Performance with 40-nm SerDes (Thursday Nov. 04, 2010)
  Avago Technologies today announced that it has demonstrated 28-Gbps Serializer/Deserializer (SerDes) performance in 40-nm CMOS process technology.
  
  
• Gennum Advances 10G EPON Technology for FTTx Deployments (Tuesday Oct. 26, 2010)
  Gennum has extended its portfolio of 10G EPON (Ethernet Passive Optical Network) offerings aimed at equipment serving FTTx installations.
  
  
• Gennum Delivers World's Fastest Crosspoint Switch (Tuesday Oct. 26, 2010)
  Gennum today introduced the industry’s first 2x2 crosspoint switch capable of supporting data rates in excess of 14 gigabits per second (Gbps) per port.
  
  
• K-micro initiates development of IEEE 1901 compliant PLC LSI (Tuesday Oct. 26, 2010)
  K-micro announced that it is developing a PLC (power line communication) LSI that is compliant with the recently approved IEEE1901 standard.
  
  
• Rochester Electronics Provides Industry's Only Established Semiconductor Replication Process (Wednesday Oct. 20, 2010)
  As the world’s largest authorized manufacturer of discontinued semiconductors, Rochester Electronics has established a process that provides customers with a replica device that matches the original semiconductor’s physical features, layer–by-layer and pin-for-pin, and is guaranteed to perform exactly as the original.
  
  
• NXP LPC1100L and LPC1300L MCUs Based on ARM Cortex-M Series Achieve Industry's Lowest 32-Bit Operating Power (Tuesday Oct. 19, 2010)
  NXP today unveiled its LPC1100L and LPC1300L microcontrollers, which have set new benchmarks in 32-bit active power consumption. The LPC1100L and LPC1300L series introduce a new low-power platform which combines ultra-low leakage design techniques with NXP’s optimized power-efficient libraries.
  
  
• Mindspeed Collaborates with ArrayComm and Continuous Computing on Scalable, Single-Chip 4G Basestation Solutions (Monday Oct. 18, 2010)
  Mindspeed today announced that it is collaborating with ArrayComm LLC and Continuous Computing Corporation on a complete commercial eNodeB solution for LTE-frequency division duplex (LTE-FDD) and LTE-Time Division Duplex (LTE-TDD) mobile networks.
  
  
• Sequans Announces New WiMAX System-in-Package (Monday Oct. 18, 2010)
  Sequans unveiled its latest Mobile WiMAX solution, the SQN1280, an all-in-one WiMAX system-in-package (SIP) for makers of handsets, tablets, USB sticks, portable hotspots, M2M modules, and a variety of consumer electronics devices
  
  
• Lantiq Announces World's First GPON SoC Family with Integrated Optical Control Circuitry featuring breakthrough level of Integration for Next Generation Networks (Monday Oct. 18, 2010)
  Lantiq today introduced the world's first GPON (Gigabit Passive Optical Network) System-on-Chip (SoC) with integrated optical control circuitry for Optical Network Termination (ONT) applications.
  
  
• NXP Introduces New Energy Metering Chip (Monday Oct. 11, 2010)
  NXP Semiconductorstoday announced the EM773 energy metering IC – the world‘s first 32-bit ARM™-based solution designed specifically for non-billing electricity metering applications.
  
  
• LSI Accelerates Innovation with 28nm Custom Silicon Platform (Wednesday Oct. 06, 2010)
  LSI today announced the availability of its 28nm custom silicon platform that includes a broad portfolio of intellectual property (IP) blocks and an advanced design methodology for custom systems-on-a-chip (SoC).
  
  
• eASIC Enables Early Rollout of On-Ramp Wireless' eNODE Solutions (Wednesday Oct. 06, 2010)
  
  
  
• LSI Introduces Its First Standard Product System-on-a-Chip for Hard Disk Drive Manufacturers (Tuesday Oct. 05, 2010)
  LSI today announced the TrueStore® SC9500, a 40-nanometer application specific standard product (ASSP) system-on-a-chip (SoC) for the notebook and desktop hard disk drive (HDD) market segments. Now sampling to HDD manufacturers, the SC9500 is the first LSI™ standard product SoC including integrated LSI hard disk controller, low-density parity check (LDPC) read channel and serial PHY integrated circuits.
  
  
• Silicon Image Unveils First MHL Products (Monday Oct. 04, 2010)
  Silicon Image today announced the availability of its first products that include support for the new MHL™ (Mobile High-Definition Link) standard – an MHL transmitter, an MHL-to-HDMI (High-Definition Multimedia Interface) bridge and an MHL-enabled HDTV port processor.
  
  
• Movidius brings HD 3D to mobile devices (Thursday Sep. 30, 2010)
  Movidius today launched Myriad 3D, its landmark mobile 3D imaging and video platform. Myriad 3D is the first platform in the world to be optimized out-of-the-box to enable a 3D experience in high definition (HD) on mobile devices, allowing handset designers for example to easily produce a whole new generation of 3D-enabled smartphones.
  
  
• Fujitsu 2nd Generation 8-bit MCU with Embedded FRAM Delivers Key Features (Thursday Sep. 23, 2010)
  Fujitsu Semiconductor Europe today introduced the 2nd generation single-chip 8-bit MCU featuring embedded FRAM (Ferroelectric Random Access Memory). The single-chip MB95R203A protects high-speed write operations against power supply interruption; eliminates chip-to-chip interconnect and maximises transaction speed and efficiencies.
  
  
• KaiSemi offers FPGA-to-ASIC replacement with a *Zero NRE* model (Thursday Sep. 16, 2010)
  Using what they describe as "a breakthrough in automated FPGA-to-ASIC conversion," fabless semiconductor company KaiSemi say that they can provide customers with a seamless, full turnkey FPGA-to-ASIC solution and sell fully compatible replacement chips at a fraction of the price.
  
  
• GigOptix to Launch 40G and 100G Bundled Solutions (Wednesday Sep. 15, 2010)
  GigOptix today announced that it will showcase its 40G and 100G Bundled Solutions. The Bundled Solutions represent what GigOptix believes is an industry first for a company providing a complete solution set comprised of a Transimpendance Amplifier (TIA), Thin Film Polymer on Silicon (TFPS(TM)) Mach-Zehnder Modulator (MZM) with a matched driver for an optical application.
  
  
• Fujitsu Launches Second Generation Ultra-fast 65GSa/s 8-Bit ADC Technology for 100G Optical Transport (Monday Sep. 13, 2010)
  Fujitsu Semiconductor Europe announces its second generation 8-bit CHArge-mode Interleaved Sampler (CHAIS) ADC for optical transport designs based on coherent detection. The new generation supports data rates from 55 to 65GSa/s and is based on the same ground-breaking ADC architecture as Fujitsu’s 56GSa/s CHAIS ADC in 65nm.
  
  
• Symwave and Fresco Logic Achieve Unsurpassed Levels for Real-Life USB 3.0 Performance (Monday Sep. 13, 2010)
  Symwave and Fresco Logic today announced their successful demonstration of the world’s highest performance USB 3.0 system achieving over 370MB/s. In this real-world demonstration using a commercially available PC, the Fresco FL1009 Host controller is connected to a USB 3.0 external storage device controlled by Symwave’s SW6318 USB 3.0 SuperSpeed RAID Storage controller, and a pair of solid state drives (SSDs).
  
  
• Trident and ARM Join Forces to Deliver a Web-Enabled Set-top Box Platform for Next Generation Internet TV Services (Friday Sep. 10, 2010)
  Trident Microsystems and ARM announced today that they have brought together all the key Web 2.0 and broadcast elements on a powerful set-top box (STB) platform that can enable consumers to seamlessly view TV programming, run rich internet applications, browse websites and share content anytime and anywhere in the home.
  
  
• Samsung Introduces High Performance, Low Power Dual CORTEX-A9 Application Processor for Mobile Devices (Tuesday Sep. 07, 2010)
  Samsung Electronics today introduced its new 1GHz ARM® CORTEX A9-based dual-core application processor, codenamed Orion, for advanced mobile applications.
  
  
• SMSC Samples Industry's First USB 3.0 Graphics Technology (Tuesday Sep. 07, 2010)
  SMSC today announced its ViewSpan USB 3.0 remote graphics technology for multiple displays. By utilizing ubiquitous USB connectivity as a display interface, ViewSpan brings versatility, expandability, and plug-and-play simplicity to the way consumers interact with their personal computers.
  
  
• Toshiba launches 24nm process NAND flash memory (Wednesday Sep. 01, 2010)
  Toshiba has announced that it today started mass production of NAND flash memories fabricated with 24nm process technology. This latest technology advance has already been applied to 2bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB)) , and which are available from today.
  
  
• Aptina Unveils 8MP Complete Camera Solution (Tuesday Aug. 31, 2010)
  Aptina today announced the availability of its new feature-rich 8MP CCS8140 imaging solution. The CCS8140 solution combines a high-quality MT9E013 8MP CMOS image sensor with an Aptina™ MT9E311 imaging co-processor while maintaining speeds similar to a standalone image processor.
  
  
• Mindspeed to Present Next Generation of 4G Base Station Technology (Tuesday Aug. 24, 2010)
  The Transcede family of SoCs integrates an unprecedented 26 programmable processors into a single device, including two ARM(R) Cortex A9(R) multi-core symmetric multiprocessing (SMP) reduced instruction set computer (RISC) processors, ten CEVA (R) digital signal processors (DSPs) and ten DSP accelerators that support the complete wideband code-division multiple access (W-CDMA), LTE or WiMAX (Layers 1, 2 and above) processing needs of single- and multi-sector base stations.
  
  
• Advantech and NetLogic Microsystems Announce 40Gbps AdvancedTCA Platform (Monday Aug. 23, 2010)
  Advantech and NetLogic Microsystems today announced their collaboration to deliver the industry’s most advanced 40-Gbps AdvancedTCA (ATCA) platform using NetLogic Microsystems’ XLP™ multi-core, multi-threaded processors with 64 NXCPUs™, knowledge-based processors, and 10GE PHY solutions.
  
  
• Lantiq's New Wireless LAN Chips Set Benchmarks for Reach and Robustness (Monday Aug. 23, 2010)
  Lantiq today introduced its latest 802.11n WLAN solutions -- the XWAY™ WAVE300 family. Featuring advanced beam-forming technology and an integrated "Thick MAC" processor, WAVE300 has been demonstrated to deliver up to 300 percent increased reach and radio coverage compared to existing solutions, while maintaining links with a minimum or even zero-packet-error rate requirement.
  
  
• Lantiq Announces Family of Gigabit Speed Gateway Processors with Industry Leading Performance, Flexibility to Support New Digital Home Services (Monday Aug. 23, 2010)
  Lantiq today announced the addition of three single-chip Gigabit Ethernet gateway solutions to its XWAY™ xRX family. The new GRX series meets the Gigabit processing requirements of DOCSIS3.0, VDSL2 and xPON access technologies and provides best-in-class performance for wireless connectivity, such as concurrent operation of 802.11n WLAN at 2.4 and 5 GHz with aggregate throughput up to 270 Mbps (Megabits per second).