D&R Headline News | Most Popular | SoC News Alerts | |

Fabless / IDM News

• Intel, Micron First to Sample 3-Bit-Per-Cell NAND Flash Memory on Industry-Leading 25-Nanometer Silicon Process Technology (Wednesday Aug. 18, 2010)
  Intel and Micron Technology today announced the delivery of 3-bit-per-cell (3bpc) NAND flash memory on 25-nanometer (nm) process technology, producing the industry's highest capacity, smallest NAND device.
  
  
• MIT Spin-Out Lyric Semiconductor Launches a New Kind of Computing With Probability Processing Circuits (Tuesday Aug. 17, 2010)
  Lyric Semiconductor, Inc. a DARPA- and venture-funded MIT spin-out, today emerged from stealth mode to launch a new technology called probability processing, which is poised to deliver a fundamental change in processing performance and power consumption.
  
  
• TI announced as the first licensee of the next generation ARM Cortex-A series processor core (Monday Aug. 09, 2010)
  Texas Instruments Incorporated (TI) today confirmed that it was the first company to partner with ARM in the conception and definition of the next generation ARM® Cortex™-A series processor core (also known as "Eagle") to be announced later this year. TI intends to use the new processor to further strengthen and extend its future OMAP™ platform offerings.
  
  
• STMicroelectronics Advances Set-Top Box Chip Features for Emerging Markets (Wednesday Aug. 04, 2010)
  STMicroelectronics has announced its latest decoder chip for low-cost, standard-definition equipment targeting fast-growing markets such as China and Eastern Europe, as well as India, where In-Stat expects pay-TV subscriber numbers to reach 90 million by 2012.
  
  
• BroadLight Announces the Launch of our 3rd Generation 40nm GPON Fiber Access Processor Family (Monday Aug. 02, 2010)
  BroadLight announced today the release of its 3rd Generation GPON Processor family. The BL23500 3rd Generation GPON Processor family is the first 40nm set of devices designed for the fiber access mass market, and feature the most cost effective implementation, lowest power consumption and the lowest cost of manufacturing of any chip in its class.
  
  
• New-Generation Microprocessor from STMicroelectronics Targets High-Performance Connectivity and Embedded Applications (Thursday Jul. 29, 2010)
  STMicroelectronics today introduced the industry's first embedded microprocessor that couples two ARM Cortex-A9 cores with a DDR3 memory interface. Manufactured in ST's low-power 55nm HCMOS (high-speed CMOS) process technology, the SPEAr1310 delivers high computing power and customizability for multiple embedded applications together with the high level of cost competitiveness offered by system-on-chip devices.
  
  
• NetLogic Microsystems Announces Breakthrough Multi-Core Processor Solution which Integrates 128 NXCPUs (Monday Jul. 26, 2010)
  NetLogic today announced the innovative XLP8128S multi-core communications processor solution that integrates 128 NXCPUs™ and over 160 programmable processing engines to deliver an unprecedented 160Gbps throughput and 240 million packets-per-second (Mpps) of intelligent application performance for next-generation 3G/4G mobile wireless infrastructure,
  
  
• Samsung First to Begin Mass Producing 2-Gigabit Green DDR3 Using 30nm Class Technology (Wednesday Jul. 21, 2010)
  Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first two-gigabit (Gb) Green DDR3 using 30 nanometer (nm) class* process technology.
  
  
• Renesas Electronics Introduces New USB 3.0 Host Controller with 85 Percent Reduced Power Consumption (Thursday Jul. 15, 2010)
  Renesas Electronics today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) host controller, featuring 85 percent reduced power consumption compared to the company's existing host controller when peripheral devices, such as mice, are not connected to the ports.
  
  
• PMC-Sierra's Second-Generation 6Gb/s SAS RAID-on-Chip Controllers Deliver Enhanced Performance for PCIe 3.0 x86 Platforms (Monday Jul. 12, 2010)
  Industry's First 24-port RoC, SRCv 24x6G, and Eight-port SRCv 8x6G Provide Unmatched Scalability, Performance and Power Savings for Next-Generation Servers and Storage
  
  
• ST-Ericsson and Ericsson showcase complete TD-LTE solution (Monday Jul. 12, 2010)
  ST-Ericsson and Ericsson have showcased the first complete end-to-end TD-LTE solution. The demonstration follows the successful execution of TD-LTE interoperability testing (IOT) between ST-Ericsson’s device platform and mobile network equipment from Ericsson.
  
  
• NetLogic Microsystems Introduces the Industry's Lowest Power 10/40/100GE PHY for Next-Generation Data Center Ethernet Applications (Monday Jul. 12, 2010)
  New NLP1342 Quad-Port PHY device from NetLogic Microsystems simultaneously supports 10/40/100 Gigabit Ethernet over either cost-effective, direct-attach twin-ax copper or SR/LR optical cabling to minimize power, latency and cost
  
  
• Sagem Wireless and ST-Ericsson to partner on LTE (Thursday Jul. 08, 2010)
  Sagem Wireless and ST-Ericsson are to partner on the development of multimode LTE/HSPA+ reference designs, devices and modules. Sagem Wireless and ST-Ericsson are collaborating on a multimode platform, which can connect to LTE, HSPA+, 3G and GSM networks, to develop a mobile broadband modem to be launched before the end of 2010.
  
  
• IPWireless and Altair Semiconductor Partner to Develop Wireless Industry's First Multi-Band, Multi-Mode Long Term Evolution (LTE) Modem (Thursday Jul. 08, 2010)
  IPWireless and Altair Semiconductor today announced a partnership to develop a suite of multi-band LTE modem products that will support key frequency bands ideally suited to global LTE deployments.
  
  
• LSI and Seagate Co-develop Technology for Next-Generation High-Capacity Hard Disk Drives (Wednesday Jun. 30, 2010)
  Industry's first 65-nanometer SoC with integrated low-density parity check (LDPC) read channel increases hard disk drive capacity and performance
  
  
• Texas Instruments delivers industry's first discrete SuperSpeed USB 3.0 transceiver, offering more than 10 times the speed of USB 2.0 (Monday Jun. 28, 2010)
  TI today introduced the industry's first SuperSpeed USB (USB 3.0) transceiver, which is capable of lightning-fast data transfers when compared to USB High-Speed devices (USB 2.0).
  
  
• PLX Sampling Industry's Highest-Performance USB SuperSpeed 3.0 Controllers (Monday Jun. 28, 2010)
  PLX Technology today announced the sampling of three new USB SuperSpeed 3.0-to-SATA controllers targeting the rapidly expanding consumer storage market.
  
  
• WiSpry and IBM Collaborate to Develop Next-Generation of Tunable Mobile Terminal Front-End Technology (Monday Jun. 28, 2010)
  WiSpry today announced that it is working with IBM to develop MEMS process technology and manufacture its tunable RF product roadmap. This development includes WiSpry's current generation of tunable impedance matching products, slated for production with a major tier-one OEM this fall, as well as future generations of highly integrated products for the entire mobile terminal front-end.
  
  
• Toshiba Launches Industry's Largest Embedded NAND Flash Memory Modules (Thursday Jun. 17, 2010)
  
  
  
• GigOptix Announces Design Win with Hatteras Networks for Next Generation ASIC Design (Thursday Jun. 17, 2010)
  GigOptix today announced that it has been awarded the next generation ASIC design by Hatteras Networks, the global leader in multi-service Ethernet solutions for enterprise access services and next-generation mobile backhaul.
  
  
• Ensphere Solutions Announces the Availability of 12-port and 4-port 10G Laser Diode Driver Arrays Targeting 10G, 40G, and 100G Long Haul Optical Modules (Monday Jun. 14, 2010)
  Ensphere Solutions today announced the availability of two new 10G laser diode driver arrays (LDDs). The 10G drivers provide a highly integrated solution for 10G, 40G, and 100G optical modules where they deliver high performance and low solution costs in four-port (ESI-1014), and twelve-port (ESI-1110) applications.
  
  
• Sital Announces the Availability of Minuet - World's smallest Mil-Std-1553 Component (Thursday Jun. 03, 2010)
  Sital today announces the availability of the world's smallest 1553 bus controller based upon fully compliant and proven 1553 designs. Compatible with DDC legacy firmware while offering significant technology advantages, Minuet is the first in a family of 1553 products from Sital that will offer great flexibility and capability to avionics and space systems designers.
  
  
• Aptina Delivers SOC Imaging Solution for 720P/30fps HD Video (Thursday Jun. 03, 2010)
  Aptina announced today the launch of the MT9M114 System-on-Chip (SOC) 720P HD video imaging solution running at 30 frames per second (fps). The new Aptina™ SOC has a 1/6”-optical format that enables low profile camera modules to easily meet thin sub-4mm height specifications.
  
  
• Symwave Cuts Power, System Cost, and Size with 2nd Generation USB 3.0 Storage Controller (Tuesday Jun. 01, 2010)
  Symwave today announced the immediate availability of SW6313, Symwave’s second generation USB 3.0 storage controller. The SW6313 device is the industry’s lowest power and highest performance solution, optimized for cost-sensitive and portable storage products.
  
  
• DiBcom to Launch DVB-T and ISDB-T Tuner-Demodulator SoCs for Cost-Effective TV Receivers (Monday May. 31, 2010)
  DiBcom its 2 new tuner-demodulator System on Chip (SoC) for DVB-T and ISDB-T full-seg, offering digital TV high performance technology for portable or fixed reception. Set top boxes, TV sets or PCTV can be addressed by these components at a very low cost.
  
  
• STMicroelectronics Expands its SPEAr Microprocessor Family for High-Performance Applications (Thursday May. 27, 2010)
  STMicroelectronics today revealed the new architecture that will be the backbone for the new members of its popular SPEAr® (Structured Processor Enhanced Architecture) family of embedded microprocessors, targeting high-performance connectivity and embedded applications.
  
  
• STMicroelectronics Announces 32nm Design Platform for Next-Generation System-on-Chip ICs for Networking Applications (Tuesday May. 25, 2010)
  STMicroelectronics today announced full availability of a 32-nm technology platform for the design and development of leading-edge ASICs for networking applications. Central to the new 32nm SoC design platform, which implements ST's 32LPH (Low-Power High-performance) process technology, is the industry's first Serializer-Deserializer (SerDes) IP available in 32nm 'bulk' silicon.
  
  
• Fresco Logic Unveils 2-port USB 3.0 Host Controller Chip (Tuesday May. 25, 2010)
  Fresco Logic unveils its FL1009 two-port USB 3.0 Host Controller with PCI Express Gen II interface. FL1009 is based on Fresco Logic’s Patented GoXtream™ xHCI Accelerator Engine, which is capable of delivering unprecedented performance and is also optimized for low-power operation, while minimizing total system cost and design cycle time.
  
  
• Open-Silicon Reaches 50 Million SoC Chips (Monday May. 10, 2010)
  Open-Silicon announced today that the Company has received orders that will push the total of chips shipped to over 50 million. This achievement highlights the strength of its business model, the OpenMODEL™, and the high quality levels achieved through Open-Silicon’s design and manufacturing efforts.
  
  
• Mindspeed Extends Transcede Family with Highly Integrated Processors for Small Cell 3G/4G/LTE Base Stations (Friday May. 07, 2010)
  Mindspeed Technologies today announced two new members of the Transcede(TM) family of wireless baseband processors. The additions extend Mindspeed's family of highly integrated system-on-chip (SoC) devices across all base station platforms for next-generation mobile networks, from picocells and enterprise femtocells to the largest macrocell implementations.