Foundries News
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TSMC Reports Third Quarter EPS of NT$1.26 (Thursday Oct. 26, 2006)
TSMC today announced consolidated revenue of NT$82.48 billion, net income of NT$32.49 billion, and diluted earnings per share of NT$1.26 (US$0.19 per ADS unit) for the third quarter ended September 30, 2006
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Winbond releases 8bit MCU and 32bit SoC (Wednesday Oct. 18, 2006)
For the W90P710 / W90N745, Winbond uses the high performance 32 bit ARM7TDMI core from ARM® Limited and integrates it with a built-in Ethernet MAC
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TSMC September 2006 Sales Report (Monday Oct. 09, 2006)
TSMC (TAIEX: 2330, NYSE: TSM) today announced its net sales for September 2006: on an unconsolidated basis, sales were NT$26,859 million, a decrease of 0.5 percent from August 2006 and an increase of 6.5 percent over September 2005. Revenues for January t
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Amkor Joins IBM, Chartered and Samsung to Broaden Common Platform Technology Offerings with Package and Test Solutions for Advanced Silicon Processes (Monday Sep. 25, 2006)
Cross-collaboration Positions Amkor to Provide Customer Ready Technologies
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Tower Semiconductor Produces Latest Wireless LAN 802.11g Chip for Atheros Communications (Tuesday Sep. 19, 2006)
This product is now ramping production in Tower's 0.18-micron, RF on standard digital CMOS technology at its advanced Fab2, thanks to the optimization of the design cycle by Tower's design services
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SMIC Denies Allegations and Files Cross-Complaint Against TSMC (Wednesday Sep. 13, 2006)
In the Cross-Complaint, SMIC sets out in detail the background of why SMIC’s leading role in Mainland China poses a substantial threat to competitors like TSMC
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TSMC August 2006 Sales Report (Friday Sep. 08, 2006)
Revenues for January through August 2006 totaled NT$213,087 million, an increase of 34.7 percent over the same period in 2005
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X-FAB Semiconductor Foundries and 1st Silicon Complete Merger (Wednesday Sep. 06, 2006)
The extended X-FAB Group is organized under the umbrella of the Belgian holding X-FAB Silicon Foundries N.V., located in Tessenderlo, Belgium
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SMIC and Synopsys Deliver Reference Design Flow 3.0 For 90-Nanometer Designs (Tuesday Sep. 05, 2006)
Reference Design Flow Features New Low Power and DFM Capabilities Based on Synopsys' Galaxy(TM) Design and Discovery Verification Platforms
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Grace and Legend Silicon work together to provide chip solution for China DTV (Tuesday Sep. 05, 2006)
Based on its self-innovated technology, Legend Silicon has successfully taped out its new China-standard DMB-TH iGB20600-2006j compliant demodulator chip LGS-8813/8913 at Grace Semiconductor on the 0.18um technology platform
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IBM, Chartered, Infineon and Samsung Announce Process and Design Readiness for Silicon Circuits on 45nm Low-Power Technology (Tuesday Aug. 29, 2006)
Industry Leaders Offer Reliable, High-Performance, Low-Leakage Platform for Early Adopters of Leading-Edge Process; Early Design Kits Available to Accelerate Transition
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Winbond Electronics Corporation and Qimonda AG Announce New Agreement for Technology Transfer (Tuesday Aug. 29, 2006)
According to this joint agreement, Winbond will adopt the 80nm DRAM process technology for its 12-fab at Central Taiwan Science Park and continuously provide DRAM production capacity to Qimonda in the future
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TSMC July 2006 Sales Report (Thursday Aug. 10, 2006)
Revenues for January through July 2006 totaled NT$186,087 million, an increase of 37.8 percent over the same period in 2005
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Top 10 Pure-Play Foundries Forecast for 2006 (Monday Aug. 07, 2006)
IC Insights expects a slowing of Chinese IC foundries' marketshare gains
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Tower Semiconductor Announces Expansion of 0.13-Micron Manufacturing Capacity With Purchase Commitment by SanDisk Corporation (Thursday Aug. 03, 2006)
Upon Such Expansion, SanDisk has Committed to Purchases of 0.13 Micron Wafers From Tower in 2007 and 2008
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SMIC Reports 2006 Second Quarter Results (Friday Jul. 28, 2006)
Sales increased 2.9% in the second quarter of 2006 to $361.4 million from $351.1 million in the prior quarter
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TSMC Reports Second Quarter EPS of NT$1.32 (Thursday Jul. 27, 2006)
Year-over-year, second quarter revenue increased 36.9% while net income and fully diluted EPS increased 85.1% and 84.8%, respectively.
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Dongbu Electronics Expands Analog IP Portfolio to Support Development of Advanced Chips for Mobile Applications with ChipIdea (Thursday Jul. 20, 2006)
Dongbu Electronics today announced the expansion of its analog intellectual property (IP) portfolio for 130nm node through a strategic partnership with ChipIdea, the globally recognized leading developer of both analog and mixed-signal technologies for ad
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Chipidea, Chartered Collaborate to Offer Advanced Mixed-Signal IP at 65nm (Tuesday Jul. 18, 2006)
Chipidea announced today it has extended its long-term relationship with Chartered Semiconductor Manufacturing (Nasdaq: CHRT and SGX-ST: Chartered), one of the world's top dedicated semiconductor foundries, to qualify key analog/mixed-signal intellectual
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TSMC and ARM Collaboration Achieves Significant Power Reduction On 65nm Low-Power Test Chip (Tuesday Jul. 18, 2006)
The year-long collaboration resulted in a 65nm test chip based on the ARM926EJ-S ™ processor demonstrating advanced power management technologies.
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TSMC Continues Industry Leadership with Reference Flow 7.0 (Monday Jul. 17, 2006)
It also adds a Magma Design Automation design implementation track to the existing Cadence and Synopsys design tracks for easy adoption of TSMC's 65nm process technology.
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TSMC June 2006 Sales Report (Monday Jul. 10, 2006)
TSMC today announced its net sales for June 2006: on an unconsolidated basis, sales were NT$27,295 million, an increase of 2.0 percent over May 2006 and an increase of 35.8 percent over June 2005
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UMC Collaborates with NTU to Deliver RF Chip for WiMax (Wednesday Jul. 05, 2006)
UMC, a leading global semiconductor foundry, and National Taiwan University (NTU) today announced that their research collaboration has resulted in the delivery of a high performance, fully integrated RF receiver design for WiMax
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Tower Semiconductor Successfully Completes NIS 140 Million (Approximately $31 Million) Fundraising (Friday Jun. 30, 2006)
Tower Semiconductor Ltd. (NASDAQ: TSEM; TASE: TSEM), a pure-play independent specialty foundry, announced today the successful completion of the previously announced offering of Units in Israel, resulting in gross proceeds of NIS 140 million (approximatel
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Central China's First 12-inch Fab Began Construction and Will be Managed by SMIC (Wednesday Jun. 28, 2006)
Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), one of the leading foundries in the world today announced that the first 12-inch (or 300mm) fab in Central China began construction in the Wuhan East Lake New Technology
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UMC's 65nm Process Sees Widespread Acceptance; UMC's Design for Manufacturing (DFM) Resources Play Major Role in Facilitating Ease of Design-in for 65nm Customers (Thursday Jun. 22, 2006)
Two customers have already qualified their designs and are in production for various 65nm products at the foundry, with eight other customers engaged and 11 product tape-outs expected by the end of summer 2006
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Elpida's Advanced 90nm DDR2 SDRAM Successfully Qualified at SMIC Beijing's 300mm Fab (Monday Jun. 19, 2006)
Elpida's Advanced 90nm DDR2 SDRAM Successfully Qualified at SMIC Beijing's 300mm Fab
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Tower Semiconductor Begins Production of a Notebook Embedded Controller developed by Winbond Israel (Thursday Jun. 15, 2006)
Tower Semiconductor Ltd. (NASDAQ: TSEM; TASE: TSEM), a pure-play independent specialty foundry, today announced production start of an Embedded Controller for Winbond Electronics Corporation (TSEC: WEC), a leading Integrated Device Manufacturer (IDM) in T
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Tower Semiconductor Manufactures Gen 2 RFID Tags for Alien Technology (Wednesday Jun. 14, 2006)
Tower Semiconductor Ltd. (NASDAQ: TSEM; TASE: TSEM), a pure-play independent specialty foundry, today announced that it is the manufacturing supplier for Alien Technology's internally-designed Gen 2 RFID (Radio Frequency Identification) integrated circuit
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Tower Semiconductor Secures a Multi-Million-Dollar Manufacturing Agreement With a Major European IC Company (Monday Jun. 12, 2006)
Tower Semiconductor, a pure-play independent specialty foundry, today announced that the company has signed a committed-sales agreement to manufacture mixed-mode IC (Integrated Circuits) for a major European fabless company