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IP / SOC Products News

• CEVA Moves to Standardize DSP-enabled Bluetooth Audio IP with New Bluebud Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables (Monday Feb. 22, 2021)
  CEVA today unveiled Bluebud™, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for the fast-growing Bluetooth audio markets, including True Wireless Stereo (TWS) earbuds, hearables, wireless speakers, gaming headsets, smartwatches and other wearable devices.
  
  
• Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications (Friday Feb. 19, 2021)
  Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, and Logic Fruit, an R&D house focused on test and measurement (T&M) applications, announced today a partnership to provide optimized T&M IP solutions for the Speedster®7t FPGA devices.
  
  
• PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications (Thursday Feb. 18, 2021)
  PLDA, the industry leader in high-speed interconnect solutions, today announced their CXL™ Verification IP Ecosystem which includes IP from partners Truechip and Avery Design Systems, who are pioneering CXL design verification.
  
  
• Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core (Thursday Feb. 18, 2021)
  Today, Micro Magic, Inc. announced its Ultra Low power 64-bit RISC-V core consuming only 10mW at 1Ghz. Micro Magic's design techniques allow its 5GHz processor to run at low voltages to save power while still achieving high performance.
  
  
• Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency (Wednesday Feb. 17, 2021)
  Renesas Electronics today announced the development of processor technologies for automotive systems-on-chip (SoCs) used in applications such as advanced driver assistance systems (ADAS) and autonomous driving (AD) systems that aim to optimize both performance and power efficiency while supporting a high level of functional safety.
  
  
• Imec Showcases World's First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip (Tuesday Feb. 16, 2021)
  With a power budget that is ten times lower than UWB’s state-of-the-art, this transmitter lays the foundation of next-gen ultra-low-power and small form-factor UWB use-cases. This is achieved while complying with the technology’s stringent international spectral emission regulations.
  
  
• Flex Logix EFLX eFPGA in design for GLOBALFOUNDRIES 22FDX (Tuesday Feb. 16, 2021)
  Flex Logix ® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that its EFLX ® eFPGA, both Logic and DSP tiles, are in design for GLOBALFOUNDRIES’ 22FDX process technology.
  
  
• 5GNR L1/L2/L3 Phy+SW Stack IP available for SoC & FPGA Ue & gNodeB development (Monday Feb. 15, 2021)
  T2M-IP, the global independent Semiconductor IP Cores, SW & Technology provider announces the availability of its partners 5GNR R15 compliant L1/2/3 Phy & SW Stack to enable customers to develop 5GNR network products and services.
  
  
• Tiempo Secure announces the availability of its Secure Element IP core on GF 22 FDX and TSMC 16 FFC (Wednesday Feb. 10, 2021)
  TESIC is a CC EAL5+ PP0084 certification-ready secure element IP that is delivered as hard macro for plug-and-play System-on Chip (SoC) integration.
  
  
• eTopus Technology Announces Innovative SerDes Technology for Data Center, Cloud, Edge, and 5G Base Stations (Wednesday Feb. 10, 2021)
  eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the presentation of its innovative high-speed transceiver architecture at the IEEE International Solid-State Circuits Conference (ISSCC) on February 16, 2021.
  
  
• Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP (Monday Feb. 08, 2021)
  Flex Logix® Technologies, Inc., supplier of the fastest and most-efficient AI edge inference accelerator and the leading supplier of eFPGA IP, and Global Unichip Corporation (GUC), the advanced ASIC leader, today announced that they have successfully taped out with first-time working silicon using the EFLX® eFPGA IP.
  
  
• Rianta Releases 800G Optimized Single Channel Ethernet Controller IP Core (Monday Feb. 08, 2021)
  Rianta Solutions Inc., a leading supplier of advanced ASIC IP Cores for Ethernet, Security and Deep Learning announces the addition of the RSm800™, a 800G Single Channel Ethernet Controller product to its IP portfolio targeting ASIC and SoC devices.
  
  
• IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust (Thursday Feb. 04, 2021)
  Crypto Quantique, a specialist in quantum-driven cybersecurity for the internet of things (IoT), is to make its universal IoT security platform, QuarkLink, available to semiconductor manufacturers and systems integrators that use root-of-trust (RoT) solutions of their own, or those sourced from other vendors.
  
  
• AnalogX Announces World's Lowest Power SERDES IP in 7nm and 6nm and Expansion Plan (Monday Feb. 01, 2021)
  AnalogX, the leading provider of multi-standard connectivity SerDes IP solutions, today announces the availability of its silicon-proven 7nm & 6nm SERDES. AnalogX is the market leader in low-power SERDES IP, serving the chiplet and chip-interconnect market with 16nm, 12nm, and now 7 nm & 6 nm technology nodes.
  
  
• PUFsecurity Crypto Co-processor PUFiot Passed NIST CAVP Certification (Monday Feb. 01, 2021)
  PUFsecurity’s chip security co-processor IP, PUFiot, has passed the CAVP certification. The certified security algorithms include AES, CMAC, DRBG, key wrap, SHA2, HMAC, KDF, and ECDSA.
  
  
• Advanced DDR Memory Interface PHY's and Controllers IP Cores available in advanced process nodes including TSMC 7FFC (Monday Feb. 01, 2021)
  T2M-IP The global independent semiconductor IP Cores & Technology provider, is pleased to announce the immediate availability of advanced DDR memory subsystem IP Cores comprising of Analog PHY’s and Controllers which support a broad range of DDR SDRAM standards.
  
  
• Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs (Thursday Jan. 28, 2021)
  Synopsys today announced the silicon proof of DesignWare® 112G Ethernet PHY IP in 5nm FinFET process, delivering significant performance, power and area advantages.
  
  
• Synopsys Delivers Industry's First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications (Wednesday Jan. 27, 2021)
  Synopsys today announced the availability of the DesignWare® Integrity and Data Encryption (IDE) Security Modules to help designers protect against data tampering and physical attacks in high-performance computing (HPC) SoCs using the PCI Express® (PCIe®) 5.0 architecture or Compute Express Link™ (CXL™) 2.0 interface.
  
  
• USB 4.0, USB 3.2, USB 3.0, USB 2.0 Silicon Proven PHYs in TSMC, UMC & SMIC Foundries available from T2MIP (Tuesday Jan. 26, 2021)
  T2M-IP The global independent semiconductor IP Cores & Technology provider, is pleased to announce the immediate availability of industry’s smallest USB Interface IP Cores on advanced nodes from TSMC, UMC and SMIC foundries, which are silicon proven and are implemented in numerous production SOC’s.
  
  
• Arasan announces its Total eMMC IP solution for TSMC 22nm process (Thursday Jan. 21, 2021)
  Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of its eMMC PHY IP for TSMC 22nm process technology
  
  
• Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes (Thursday Jan. 21, 2021)
  Faraday Technology Corporation(TWSE: 3035), a leading ASIC design service and IP provider, today unveiled its complete imaging and display high-speed interface IP set on UMC’s 40LP and 28HPC/HPC+ process nodes, including MIPI D-PHY (TX/RX, controller), V-by-One HS (TX/RX, controller), and LVDS (TX/RX, I/O).
  
  
• PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol (Monday Jan. 18, 2021)
  PLDA, the industry leader in high-speed interconnect solutions, today announced that PLDA’s industry-leading XpressLINK-SOC™ CXL IP provides full support for the AMBA® CXS Issue B (CXS-B) interface protocol.
  
  
• Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology (Thursday Jan. 14, 2021)
  Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, today announced the immediate availability of its 2nd Generation MIPI D-PHY v1.1 IP supporting speeds of up to 1.5 Gbps on TSMC 22nm process technology for SoC designs.
  
  
• Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series (Thursday Jan. 14, 2021)
  Chips&Media, a global leading semiconductor HW IP provider that specializes in video codec, image signal processing, and computer vision, today shared its rolled-out product list for the next-generation video codec IPs, the WAVE6 series.
  
  
• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family (Tuesday Jan. 12, 2021)
  SensPro2™ builds on CEVA’s industry leadership in sensor hub DSPs, delivering 6X more DSP processing for computer vision, 8X more DSP performance for Radar processing, a 2X improvement in AI inferencing, and 20% more power efficient versus its predecessor, at the same process node.
  
  
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core (Monday Jan. 11, 2021)
  LeapMind is pleased to announce that it has officially launched the commercial version of its Efficiera ultra-low power consumption AI inference accelerator IP core, which incorporates deep learning capabilities into various edge devices.
  
  
• CFX announces commercial availability of anti-fuse OTP technology on 90nm BCD process (Wednesday Jan. 06, 2021)
  CFX, the one stop shop of embedded flash memory IP and stand alone flash memory IC provider announced today commercial availability of anti-fuse OTP technology on 90nm BCD process.
  
  
• iWave Unveils the Implementation of ARINC 818-2 IP Core On Microsemi PolarFire FPGA (Wednesday Dec. 23, 2020)
  iWave Systems, being the leading FPGA design house, offers an extensive portfolio of FPGA IP Cores. And one of the most predominant being ARINC 818 IP. Today, we are excited to announce the successful implementation of iWave’s ARINC 818 IP Core on Microsemi PolarFire FPGA devices.
  
  
• Rianta Releases AES Crypto and HMAC Acceleration ASIC IP Cores (Monday Dec. 21, 2020)
  Rianta Solutions Inc, a leading supplier of high quality ASIC IP Cores for Ethernet, Security and Deep Learning announces a new family of AES bulk encryption and HMAC acceleration IP cores targeting ASIC and SoC devices for Applications such as CXL IDE, IPsec, and Storage.
  
  
• Secure-IC announces the availability of its protection technologies in the cloud (Friday Dec. 18, 2020)
  Secure-IC, the rising leader and the only global provider of end- to-end cybersecurity solutions for embedded systems and connected objects, announces today the availability of its protection technologies (“Silicon Intellectual Property” – IPs) in the Cloud.