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IP / SOC Products News

• Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology (Wednesday Aug. 19, 2020)
  Moortec, the go-to leaders of innovative in-chip monitoring solutions today announced the availability of its well-established sensing fabric on TSMC’s industry-leading N6 process technology.
  
  
• Rianta Releases 800G MACsec ASIC/SoC IP Core for Next-Gen Data Center and 5G Backhaul Applications (Tuesday Aug. 18, 2020)
  Rianta Solutions Inc, a leading supplier of high quality ASIC IP Cores for Ethernet, Security and Deep Learning announces a new 800G MACsec IP core targeting ASIC and SoC devices. Rianta’s RS_MCS800™ 800G Ethernet MACsec IP package serves applications up to 800G for Datacenter, Hyperscalers, Enterprise Networking, and 5G Wireless Infrastructure.
  
  
• CAST HDLC/SDLC IP Core Now Ready for DO-254 Compliance in Airborne Systems (Thursday Aug. 06, 2020)
  Silicon intellectual property provider CAST, Inc. today announced a new version of its HDLC/SDLC IP core that helps avionics system developers achieve compliance with the DO-254 standard at the most stringent Design Assurance Level, DAL-A.
  
  
• PUFsecurity Launches Unique Quantum-Tunneling PUF-based Root-of-Trust (Tuesday Aug. 04, 2020)
  The new IP – PUFrt – is a PUF-based hardware root-of-trust that includes proprietary NeoPUF as the core technology. A physical unclonable function (PUF) provides a "digital fingerprint" that can serve as a unique identifier for a chip, as well as other security purposes, including encryption, identification, authentication, security key generation.
  
  
• M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process (Friday Jul. 24, 2020)
  M31 Technology Corporation (Taiwan stock code: 6643), a professional global silicon Intellectual Property (IP) developer, today announced the completion of a comprehensive physical IP platform on TSMC 22nm process, which includes 22nm ultra-low power (22ULP) and 22nm ultra-low leakage (22ULL) process technologies.
  
  
• Mobile Semiconductor's Enhanced Memory Compilers Dramatically Improve Power On Edge AI Devices (Thursday Jul. 23, 2020)
  Mobile Semiconductor, a Seattle WA based company, today announced a new generation of Ultra Low Leakage (ULL) and Ultra Low Power (ULP) SRAM Memory Compilers that dramatically improve the performance to power ratio for Edge AI chips
  
  
• SiFive Elevates Custom SoC Design With Enhanced Processor IP Portfolio (Thursday Jul. 23, 2020)
  SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced a comprehensive update to SiFive’s RISC-V Core IP portfolio with the public availability of the SiFive 20G1 release.
  
  
• Codasip Releases the First Linux-Capable RISC-V Core Bk7 Optimized for Domain-Specific Applications (Tuesday Jul. 21, 2020)
  Codasip today announced the official release of Bk7, the most advanced core in the Codasip family of RISC-V processor IP to date, built specifically with customization and domain-specific optimization in mind.
  
  
• PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect (Monday Jul. 20, 2020)
  PLDA, the industry leader in PCI Express® IP and data interconnect solutions, today announced the Robust Verification Toolset, a breakthrough approach to IP verification dramatically increasing Design accuracy and speeding-up the time-to-market.
  
  
• CFX announces commercial availability of anti-fuse OTP technology on SMIC 40HV process (Monday Jul. 20, 2020)
  CFX, the One-Stop Shop for nonvolatile memory technology and products announced today commercial availability of anti-fuse OTP technology on SMIC 40HV process.
  
  
• Menta Announces New Software Version and New Adaptive DSP at DAC 2020 (Thursday Jul. 16, 2020)
  Menta today announced the release of the new Menta Origami Programmer 2020.1, an enhanced version of the company’s innovative, robust and easy-to-use programming software.
  
  
• Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development (Thursday Jul. 16, 2020)
  Faraday Technology today launched its next generation IoT SoC development platform, called Ariel™, which is built on UMC’s 40uLP logic process combined with Infineon’s SONOS eFlash technology.
  
  
• Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors (Wednesday Jul. 15, 2020)
  Ensilica, a leading provider of custom ASIC design and supply services, has created a customisable single-chip medical sensor ASIC platform to speed the development of wearable medical / fitness vital-sign monitoring products.
  
  
• DMP releases AI Processor IP Core "ZIA DV740" (Monday Jul. 13, 2020)
  Digital Media Professionals is pleased to announce the release of "ZIA™ DV740" (hereinafter referred to as "DV740"), the latest version of AI processor IP specialized for deep learning/AI (Artificial Intelligence) inference processing at the edge side.
  
  
• DMP releases IP Core "ZIA ISP" (Monday Jul. 13, 2020)
  ZIA ISP is an IP core that performs image processing on the RAW data output from an image sensor. ZIA ISP accelerates the camera signal processing pipeline in a small size, which performs correction processing for the optical system such as lenses and scratch correction caused by variations in the image sensor for each pixel unit.
  
  
• Imagination announces XS, the automotive industry's most advanced GPU IP (Wednesday Jul. 08, 2020)
  Imagination Technologies announces the XS GPU product class for automotive, enabling ADAS acceleration and safety-critical graphics workloads. XS represents the most advanced automotive GPU IP created to-date and is the first licensable IP in the industry that is ISO 26262-capable, a standard that addresses risk in the automotive industry.
  
  
• High Performance Channel Coding Solutions on Xilinx Zynq UltraScale+ RFSoC Devices (Wednesday Jul. 08, 2020)
  AccelerComm, the company supercharging 5G with Optimisation and Latency Reduction IP, today announced the availability of its Channel Coding software using the Zynq® UltraScale+™ RFSoC devices from Xilinx, Inc. with Standards Based DPDK/BBDEV for 5G Systems.
  
  
• Dolphin Design unveils the final piece of their platform offer with BAT, an audio solution for high quality AIoT applications (Monday Jul. 06, 2020)
  To meet the future market requirements, Dolphin Design has developed a high-performance, energy efficient audio platform, called BAT, which can provide a voice interface for almost any device while shortening the design Time-To-Market and adding an insignificant power cost.
  
  
• Innosilicon multiple high-speed interface IPs, based on the SMIC 14nm process, R&D and mass production proven (Thursday Jul. 02, 2020)
  Innosilicon has announced today that a number of high-performance domestic autonomous and controllable high-speed interface IPs, based on SMIC 14nm process, have been successfully one-time verified in the SOC products from domestic mainstream customers, and entered the commercial mass production.
  
  
• Dolphin unveils two break-through DSP and AI digital platforms dedicated to edge computing applications (Monday Jun. 29, 2020)
  
  
  
• T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm. (Wednesday Jun. 24, 2020)
  The IP is Bluetooth 5.2 compliant supporting Audio over BLE as well as backwards compatible with EDR & BR making this the first Bluetooth Dual Mode RF IP available in TSMC22ULL to support the latest features while providing full Bluetooth legacy support.
  
  
• Rianta Releases 200G/400G Single Channel MAC IP Core (Tuesday Jun. 23, 2020)
  Rianta Solutions Inc., a leading supplier of advanced ASIC IP Cores for Ethernet, Security and Deep Learning announces RSm400™, a new 200G/400G Single Channel Ethernet MAC/PCS/FEC product addition to its IP portfolio targeting ASIC and SoC devices.
  
  
• Powering next-generation in-vehicle experiences with Arm Mali GPU virtualization (Thursday Jun. 18, 2020)
  Updates to Arm Mali Driver Development Kit (DDK) in support of key requirements of digital cockpit use-cases; Audi and Samsung among partners implementing Mali IP in 2022 model year vehicles
  
  
• Silex Insight Extends Their Crypto Coprocessor Offering by Introducing 2 New Variants (Compact & Premium) (Thursday Jun. 18, 2020)
  Silex Insight, a leading provider for flexible security IP cores, announces today a complete family (3 variants) of NIST-validated crypto coprocessors by adding 2 new versions (Compact & Premium) to their portfolio to serve the different market needs.
  
  
• Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center (Thursday Jun. 18, 2020)
  Rambus Inc., a premier silicon IP and chip provider making data faster and safer, today announced it has expanded its portfolio of high-speed interface IP on TSMC’s industry-leading 7nm process with the addition of its silicon-demonstrated 112G XSR/USR PHY
  
  
• Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips (Tuesday Jun. 16, 2020)
  Agile Analog, a leading provider of semiconductor analog IP, today announced that they have worked with EnSilica, a leading fabless design house focused on custom ASIC design and supply services, to both fabricate and test their latest analog IP products, and to validate that their advanced product delivery processes provide maximum benefit to Agile Analog’s end customers.
  
  
• Dolphin Design unveils CHAMELEON, a revolutionary event-based MCU subsystem (Monday Jun. 15, 2020)
  Dolphin Design, a leading provider of semiconductor IP and design platforms, unveils today its innovative event-based MCU subsystem platform – CHAMELEON.
  
  
• Silex Insight Announces Record-breaking 1.5Tb MACsec Solution To Boost Data Center and 5G Infrastructure (Thursday Jun. 11, 2020)
  Silex Insight announces today their 1.5Tb (Terabit) MACsec (Media Access Control security) engine (BA451) that anchors MACsec security in hardware. In this way, network operators can get the full performance benefits of 1.5Tb Ethernet, and the security benefits of MACsec.
  
  
• Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process (Wednesday Jun. 10, 2020)
  Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy measurement across a wide temperature range at enhanced conversion speeds.
  
  
• SmartDV Delivers New Design IP for Video, Imaging, Entertainment System Protocols (Thursday Jun. 04, 2020)
  SmartDV™ Technologies, the Proven and Trusted choice for Design and Verification Intellectual Property (IP), today delivered a series of video, imaging and entertainment system Design IP compliant with a variety of standard protocol specifications.