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IP / SOC Products News

• Chelsio Launches Terminator Core IP (Friday Nov. 14, 2014)
  Chelsio Communications, a leading provider of 40Gb Ethernet (40GbE) Unified Wire Adapters and ASICs, announced today that it has launched a new product offering, the Terminator Core, a configurable kit for building high performance Converged Ethernet solutions.
  
  
• Xilinx Announces Industry's First Low Latency 25G Ethernet IP for FPGAs to Address Throughput Challenges in Data Center Applications (Wednesday Nov. 12, 2014)
  Xilinx today announced the industry's first low latency 25G Ethernet IP for FPGAs to address throughput challenges in data center applications. The low latency 25G Ethernet MAC and PCS LogiCORE™ IP solution helps to reduce data center CapEx by providing a migration path from 10G to 25G links and delivers a drastic increase in performance by more than doubling the front panel bandwidth between top of rack switches and servers (10G to 25G).
  
  
• NTLab announces highly linear GPS/GLONASS/Galileo/BeiDou RF front-end with reduced power consumption (Wednesday Nov. 12, 2014)
  NT1051 is a dual-channel multi-frequency (L1/L2/L3/L5) mutli-system (GPS/GLONASS/Galileo/BeiDou) RF front-end. Manufactured in 0.18um TSMC BiCMOS technology, it provides operability of GNSS receiver even if interference power is 120dB higher than satellite signal.
  
  
• Scalable PowerVR Series7 GPUs target applications from wearables to servers, reaching teraflop performance (Monday Nov. 10, 2014)
  Imagination Technologies introduces PowerVR Series7, the latest generation of the PowerVR Rogue GPU architecture and an entire line-up of GPUs which scale from 16 to 512 arithmetic logic unit (ALU) cores, providing unprecedented scalability, efficiency and performance.
  
  
• Dolphin Integration dedicated features for shortening and easing the Industrial Test of Audio converters (Monday Nov. 10, 2014)
  Dolphin Integration supply leading fabless companies for more than 25 years with dozens of audio converters which have been used in millions of SoCs. The cost of Industrial Test can represent up to 35 % of the fabrication cost. Therefore, the challenge is to keep the industrial test cost as low as possible while ensuring high reliability products.
  
  
• Kandou Introduces High Bandwidth, Low Power, In-Package Chip Interconnect Enabling Lower Cost Semiconductor Solutions (Thursday Nov. 06, 2014)
  Kandou Bus has announced the Glasswing™ family of chip interconnects targeted for in-package chip-to-chip links. Kandou introduced Chord™ Signaling in February 2014 and outlined how signals can be correlated across more than two wires to achieve higher bandwidth and lower power with excellent signal integrity and low latency.
  
  
• Recore Systems announces FlexaWare at electronica 2014 in Munich (Tuesday Nov. 04, 2014)
  During electronica 2014 in Munich next week, Recore Systems announces FlexaWare®, an easy programmable, flexible many-core embedded platform. The FlexaWare® platform consists of hardware, a runtime and a software development environment. It is designed from the ground up to offer the flexibility and scalability needed to cater to a range of applications from clear cut to compute intensive and massively parallel.
  
  
• Synopsys Announces Availability of DesignWare Non-Volatile Memory IP for TowerJazz 180-nm Process Technology (Thursday Oct. 30, 2014)
  Synopsys today announced the availability of the silicon-proven DesignWare® AEON® Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.
  
  
• Synopsys' New DesignWare Sensor and Control IP Subsystem Delivers Ultra Low Power Sensor and Control Processing for SoCs (Wednesday Oct. 29, 2014)
  Synopsys today announced the new DesignWare® Sensor and Control IP Subsystem, a complete hardware and software solution optimized for a wide range of ultra-low power embedded sensor and control applications.
  
  
• Synopsys' New USB 3.1 IP Solution Enables 10 Gbps Data Transfer Speeds for Storage, Digital Office and Mobile Applications (Tuesday Oct. 28, 2014)
  Synopsys today introduced the industry's first USB 3.1 IP solution, consisting of DesignWare® USB 3.1 Device Controller, an IP Virtual Development Kit (VDK) and verification IP (VIP) to accelerate the development of high-performance storage, digital office and mobile system-on-chip (SoC) applications.
  
  
• TSMC, Kilopass Deliver NVM OTP IP for the 16FinFET Process Node (Tuesday Oct. 28, 2014)
  Kilopass announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC’s 16 nanometer (nm) FinFET process.
  
  
• ARM System-wide Approach Delivers Efficient, Rich Media Solution (Tuesday Oct. 28, 2014)
  ARM today announced a suite of integrated media IP designed to efficiently deliver rich visual content. The ARM® Mali™ media IP suite is ideal for the highest volume segments for smartphones and tablets, which is currently a billion unit opportunity.
  
  
• Dolphin Integration reveal a cost effective solution to handle over-voltage operation in battery powered SoCs (Monday Oct. 27, 2014)
  Until now, portable devices supplied by USB, Li-ion or NiMH batteries with voltage levels up to 5.5 V could not use standard process devices, such as 3.3 V CMOS I/O transistors. This thus lead Fabless companies to use expensive alternatives, such as external regulators or expensive process options, including HV/BCD processes. Today, Dolphin Integration propose a cost effective alternative to such solutions with a set of Over-voltage Protection Modules (OPM).
  
  
• Soft Machines Unveils VISC Microprocessor Architecture Breakthrough; Revives Performance-per-Watt Scaling (Friday Oct. 24, 2014)
  Soft Machines Inc., a Silicon Valley-based semiconductor startup company, today announced the Soft Machines VISC™ architecture. The VISC architecture is a breakthrough in microprocessor performance-per-watt scaling and will significantly improve performance and power for all segments of the computing ecosystem.
  
  
• SMIC and Maxscend collaborate on 55nm RF IP platform (Thursday Oct. 23, 2014)
  SMIC and Maxscend Technologies announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm Low Leakage (LL) logic process. This IP has now been integrated into one of SMIC customers' product tape-out.
  
  
• ARM Extends Scalability of CoreLink for Infrastructure Compute (Thursday Oct. 23, 2014)
  ARM today announced new additions to its suite of enterprise-class ARM® CoreLink™ Cache Coherent Network (CCN) SoC interconnects, underscoring its commitment to providing a flexible architecture from sensors to servers. The CoreLink CCN-502 and CoreLink CCN-512 interconnects extend the current family for data center and infrastructure equipment that scales from the edge of the network to the core.
  
  
• Intilop's 16K Concurrent TCP & UDP Session Accelerator Core - Xilinx Platform Now Available for Immediate Deployment in Data Center and High Performance Computing (Thursday Oct. 23, 2014)
  Intilop has released their 16K concurrent-TCP-session Hardware Accelerator Pre-Ported and tested on an Alpha Data ADM-PCIE-7V3 card. This deployment ready with pre-ported and verified 10G TCP Accelerator (TCP Full Offload Engines) that implements16 Thousand Simultaneous TCP Connections, unlimited continuous connections and Bandwidth of more than 1.1 Gigabyte/sec per port regardless of number of simultaneous or active TCP Sessions.
  
  
• Tamba Releases New Ultra-Low Latency Ethernet Cores for Xilinx UltraScale 20nm FPGA - Lowest Latency Achieved on an FPGA Device (Wednesday Oct. 22, 2014)
  Tamba Networks today announced the availability of version 2 of its Ethernet IP products for use on Xilinx, Inc. Virtex® UltraScale™ devices. This latest release delivers new performance enhancements that further increase the latency and size gap between existing IP available from other vendors.
  
  
• New BA20 Processor IP Features "Zero-Stage Pipeline" for Energy and Performance Efficiency (Wednesday Oct. 22, 2014)
  Wearable devices, Internet of Things (IoT) sensors, and other mobile products challenge the limits of modern processor efficiency, with features requiring significant processing capability but also demanding ultra-low energy consumption. A new 32-bit processor announced today by Beyond Semiconductor and CAST Inc. meets this challenge by combining state-of-the-art design techniques with an architectural feature seemingly drawn from the past: a zero-stage execution pipeline the companies call the PipelineZero™ Architecture.
  
  
• eMemory NeoEE SIP Advances into Automotive Electronics Applications (Tuesday Oct. 21, 2014)
  Following the expansion of multiple-time programmable (MTP) silicon IP (SIP) NeoEE in wireless communication applications; eMemory, the global leader in embedded non-volatile memory (eNVM) announced today the specification upgrade of NeoEE from consumer electronics level (85℃/10 years) to 150℃/10 years, which meets the AEC-Q100 Grade 0 required by automotive electronics.
  
  
• Synopsys Introduces Industry's First On-Chip Memory Test and Repair Solution for Embedded Flash (Monday Oct. 20, 2014)
  Synopsys today introduced the DesignWare® STAR Memory System® for Embedded Flash product, the industry's first integrated memory test and repair solution with test algorithms optimized for on-chip embedded flash memories.
  
  
• Dolphin Integration introduce a new foundry sponsored low power memory for LCD Drivers and Touch Screen Controllers (Monday Oct. 20, 2014)
  In order to reach the stringent low power requirements of LCD Drivers and Touch Screen Controllers, Dolphin Integration launch a foundry sponsored Single port RAM for the UMC 110 nm embedded Flash process.
  
  
• Cadence Announces Industry's First Multi-Protocol DDR4 and LPDDR4 IP Solution (Thursday Oct. 16, 2014)
  The Cadence® DDR controller and PHY IP can scale up to 3200Mbps, which provides flexibility for designers to easily take advantage of higher performance DDR4 and LPDDR4 DRAMs when they become available, without having to redesign their systems on chip (SoCs).
  
  
• New DesignWare ARC HS38 Processor Doubles Performance for Embedded Linux Applications (Tuesday Oct. 14, 2014)
  Synopsys today announced availability of the DesignWare® ARC® HS38 Processor, the latest addition to the ARC HS Family of high-speed processor IP cores. A single HS38 processor delivers up to 4200 DMIPS at speeds up to 2.2 GHz in typical 28-nanometer (nm) silicon, more than twice the performance of previous generation ARC 770D cores supporting Linux.
  
  
• IPrium releases PSK Demodulator (Tuesday Oct. 14, 2014)
  IPrium LLC today announced that it has expanded its family of Demodulator IP products with a new PSK Demodulator IP Core for satellite systems. The PSK Demodulator IP Core has been silicon-proven using multiple development boards and is compliant with standards for satellite transmission.
  
  
• eASIC and Comcores Announce Support for C-RAN with CPRI v6.0 (Monday Oct. 13, 2014)
  eASIC and Comcores today announced immediate support for Common Public Radio Interface (CPRI) v.6.0 using eASIC’s Nextreme-3 28 nm devices enabling energy efficient and high-performance wireless C-RAN solutions.
  
  
• Cadence Offers Industry' First MIPI SoundWire Controller IP Solution (Thursday Oct. 09, 2014)
  Cadence today announced the industry’s first MIPI® SoundWireSM Controller Intellectual Property (IP). SoundWire is a new digital audio interface specification from the MIPI Alliance that enables bi-directional digital communication with a focus on low complexity and low gate count, making it attractive to many mobile design applications.
  
  
• Cortus Launches Optimized Low-Power Processor for Multi-Core Implementations in Connected Devices (Tuesday Oct. 07, 2014)
  
  
  
• Cortus Targets Sensors, Wearables and other IoT Applications With New Low Power Embedded 32-bit Processor Core (Tuesday Oct. 07, 2014)
  Cortus announced the first of a new family of products based on its v2 instruction set today. The APS23 core was built to deliver a new level of efficiency, ease of integration and cost of ownership for low-power, connected intelligent devices.
  
  
• RFEL adds new Wideband DDC to its signal processing range (Monday Oct. 06, 2014)
  RFEL has announced the latest addition to its range of award winning FPGA based signal processing solutions. The flexible Wideband Digital Down-Converter (Wideband DDC) IP core is designed to accept wideband digitised data at sample rates of up to 3.6GS/s, supporting first or second Nyquist bandwidths of up to 1.8GHz.