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Fabless / IDM News

• Cavium Networks Introduces ECONA Family of Super Energy Efficient ARM-Based System-on-Chip (SoC) Processors for the Digital Home That Break the 1 Watt Barrier (Tuesday Sep. 08, 2009)
  The ECONA CNS3XXX Family of Single and Dual Core ARM® SoC Processors Enable High Performance, Intelligent Home Networks While Slashing Power and Cost for Next-Generation Gateways, Storage and Consumer Electronics (CE) Devices in the Digital Home
  
  
• Broadcom's New International Cable Set-Top Box SoC Solutions Drive Compelling High Definition TV and Advanced Connectivity (Tuesday Sep. 08, 2009)
  Integrated Dual 866MHz Cable Tuners, DOCSIS(R)/EuroDOCSIS(TM) and MoCA(R) 1.1 Technology Enable IP Video and Multi-Room High Definition DVR TV Services
  
  
• NXP Brings Unrivalled Performance to Mainstream HD DVRs and Set-Top Boxes with Industry's First Fully Integrated 45nm SoC Platform (Friday Sep. 04, 2009)
  Having developed the industry’s first 45nm digital TV platform, NXP is maintaining its leadership in manufacturing innovation by introducing the world’s first 45nm set-top box SoC solution integrating multi-channel broadcast receivers.
  
  
• NEC Electronics Introduces new SoCs for Set-Top Boxes with Extensive Multi-Format Video Support (Monday Aug. 24, 2009)
  NEC Electronics today announced the availability of a new image-processing solution, the EMMA3™SL/P system-on-chip (SoC) based on NEC Electronics’ enhanced multimedia architecture (EMMA) platform.
  
  
• Infineon Introduces Energy Efficient Single-Chip XWAY WAVE100 Family for Low-Cost 802.11n WLAN Home Gateways (Thursday Aug. 13, 2009)
  The new XWAY™ WAVE100 ICs provide a high-performance and cost-effective solution for wireless network access points that are compliant to the 802.11n draft standard for data rates up to 150Mbit/s as well as the 802.11 b/g standard.
  
  
• Atmel Announces SiliconCity Flexible Architecture for Low-Cost Custom Defined SoC Development (Tuesday Aug. 11, 2009)
  Atmel announced today a new custom architecture for 90nm SiliconCity ASIC development, providing up to 350K gates/mm2, offering customers gate densities in the range of a standard cell ASIC.
  
  
• STMicroelectronics Introduces Silicon Tuner Supporting Digital-Terrestrial TV Standard as Analog Switch-Off Gathers Pace (Friday Aug. 07, 2009)
  As demand grows for economical equipment allowing households to access digital terrestrial television services, STMicroelectronics has introduced a single-chip DVB-T silicon tuner that enables manufacturers to simplify product assembly and supply-chain management.
  
  
• Global Unichip Provides High Speed Interface Total Solution (Thursday Aug. 06, 2009)
  Global Unichip announced its Gbps level high speed production-proven total solution. The total solution includes comprehensive IP portfolio, ASIC implementation, chip + package co-design, and production testing solution.
  
  
• Physical layer and protocols provide complete MIPI IP solution for SoC development (Tuesday Jul. 28, 2009)
  The latest intellectual property (IP) from Toshiba Electronics Europe’s ASIC & Foundry Business Unit will simplify and speed the implementation of MIPI®-compliant system-on-chip (SoC) designs for mobile phones and associated devices. The Toshiba MIPI (Mobile Industry Processor Interface) offering comprises a physical layer and protocols that build on this layer to support the rapid development of complete MIPI-compliant transmit and receive solutions.
  
  
• Fujitsu Launches USB 3.0 to SATA Bridge IC (Tuesday Jul. 28, 2009)
  Fujitsu today announces the MB86C30A, one of the first available USB 3.0 to SATA bridge ICs, which supports the ultra-fast 5Gbps maximum data transfer rate of SuperSpeed USB, the USB 3.0 specification
  
  
• Samsung and Intrinsity Jointly Develop the World's Fastest ARM Cortex-A8 Processor Based Mobile Core in 45 Nanometer Low Power Process (Monday Jul. 27, 2009)
  Samsung and Intrinsity today jointly announced the industry’s fastest mobile processor core implementation of the dual-issue ARM® Cortex™-A8 processor architecture in 45 nanometer (nm) Low Power (LP), low leakage process technology. This Cortex-A8 implementation, code-named Hummingbird, delivers 2000DMIPS at 1GHz. The Hummingbird comes with 32KB each of data and instruction caches, an L2 cache, the size of which can be customized, and an ARM® NEON™ multi-media extension.
  
  
• TSMC and Global Unichip Collaborate On Silicon Proven SiP Solution in TSMC Reference Flow 10.0 (Monday Jul. 27, 2009)
  Global Unichip announced today the application and validation of System-in-Package (SiP) design solution in TSMC Reference Flow 10.0 as the fruit of collaboration with TSMC. The SiP methodology has been fully qualified with GUC production case and achieved good silicon correlation.
  
  
• Atmel Introduces the AT697F Radiation-Hardened SPARC V8 Processor for Space Missions (Friday Jul. 24, 2009)
  Atmel® announced today a new radiation-hardened SPARC® processor for space applications, the AT697 Revision F delivering 90 MIPs at 100 MHz over full temperature and voltage ranges for only 0.7W.
  
  
• Silicon Image Introduces First Port Processor With 3D Over HDMI Capability (Wednesday Jul. 22, 2009)
  Silicon Image today introduced the SiI9389 port processor incorporating High-Definition Multimedia Interface(R) (HDMI(R)) Specification Version 1.4 features including 3D over HDMI, HDMI Ethernet Channel, Audio Return Channel and Content Type Bits.
  
  
• Samsung First to Begin Mass Producing 2-Gigabit DDR3 Using 40nm Class Technology (Wednesday Jul. 22, 2009)
  Samsung announced today that it has begun mass producing the industry's first two gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology.
  
  
• Key ASIC Collaboration to Expand Its ASIC Products and Licenses PowerPC (Tuesday Jul. 21, 2009)
  Key ASIC today announces the company’s ability to offer IBM’s semiconductor technology to its customers. As a part of the Key ASIC/ IBM relationship, Key ASIC will sell IBM produced wafers which contain design content and services from Key ASIC to its customers.
  
  
• NXP and TSMC Deliver Industry's First 45nm Single-Chip Digital TV Platform (Thursday Jul. 09, 2009)
  Featuring NXP’s PNX85500 processor, built on TSMC’s 45nm Low Power (LP) process technology, the NXP TV550 digital TV platform is a production-ready reference design that reduces time-to-market with a major step forward in functional integration for system cost down.
  
  
• Innovasic Semiconductor Announces the Availability of Pin-Compatible 80C186XL and 80C188XL Embedded Processors (Monday Jul. 06, 2009)
  Innovasic Semiconductor, a leader in extended life semiconductor solutions, today announced engineering samples are shipping for the IA186XL and IA188XL. The IA186XL and IA188XL are form, fit, and function compatible with the original Intel® 80C186XL and 80C188XL 16-bit high-integration embedded processors, and also serve as replacements for the Intel® base 80C186 and 80C188 devices
  
  
• Samsung using 45-nm process for ARM-11 based processor (Monday Jun. 29, 2009)
  Samsung Electronics Ltd has started sampling its ARM11-based application processor that will be made on its 45-nm CMOS process technology.
  
  
• XMOS puts multi-core in mass market for under US$ 5 per core (Wednesday Jun. 24, 2009)
  XMOS has today launched its 2nd generation of event-driven processors, the XS1-L series, targeted at the mass electronics market with a sub $5 price point. Built on a 65-nanometer process, the XS1-L1 is sampling with customers now.
  
  
• Samsung Electronics and Numonyx join forces on Phase Change Memory (Wednesday Jun. 24, 2009)
  Samsung Electronics and Numonyx today announced they are jointly developing market specifications for Phase Change Memory (PCM) products, a next generation memory technology that will help enable makers of feature-rich handsets and mobile applications, embedded systems* and high-end computing devices to meet the increasing performance and power demands for platforms loaded with content and data.
  
  
• Silicon Image Introduces First Products Incorporating HDMI 1.4 Features for DTV and Home Theatre Applications (Monday Jun. 22, 2009)
  Silicon Image today introduced the SiI9387 port processor and the SiI9334 transmitter, the first semiconductor products to incorporate the latest HDMI(R) 1.4 specification features for digital television (DTV) and home theatre applications.
  
  
• RedMere Support For HDMI 1.4 Specification (Thursday Jun. 18, 2009)
  RedMere, the leader in high-speed chip and cable technology solutions, endorses HDMI Licensing LLC 1.4 Specification announcement and confirms availability of silicon to support new active cables designs for HDMI 1.4.
  
  
• BroadLogic Paves the Way to a New Era in Narrowcast and Unicast Cable Services with the Industry's First Ultra-Dense QAM Modulator Chip (Monday Jun. 15, 2009)
  BroadLogic today announced the TeraQAM BL85000 the industrys first ultra-dense quadrature amplitude modulation (QAM) chip for systems that transport video, voice and data signals.
  
  
• STMicroelectronics Unveils Ultra-Low-Power Technology Platform for 8-bit and 32-bit Microcontrollers, Enabling Next-Generation Power-Saving Products (Monday Jun. 15, 2009)
  STMicroelectronics has announced details of a new ultra-low-power technology platform for building a range of 8-bit and 32-bit microcontrollers, which will enable future generations of electronic products to consume less power, meet evolving energy-efficiency standards, and operate for longer from their batteries.
  
  
• Geo Semiconductor Inc. Launches Operations (Monday Jun. 15, 2009)
  Geo Semiconductor today announced its formation and acquisition of major IC business lines and key elements of the IP portfolio of Silicon Optix Inc., including the Realta and the Geo ICs.
  
  
• ARM Utliizes eASIC Devices to Validate Cortex-A9 MPCore Multicore Processor-Based Devices (Thursday Jun. 11, 2009)
  eASIC today announced that ARM has successfully validated it’s next-generation Cortex™-A9 MPCore™ multicore processor using eASIC’s Nextreme NEW ASICs.
  
  
• Ember Unveils Industry's Highest Performance ZigBee Chips (Monday Jun. 08, 2009)
  Ember today unveiled the EM300 Series, its next-generation ZigBee chip family that packs the industry’s highest wireless networking performance and application code space into the lowest power-consuming chip set.
  
  
• Cavium Networks Introduces Industry Leading Integrated ECONA ARM Processor for Small Form Factor Applications (Tuesday Jun. 02, 2009)
  Cavium Networks today announced the introduction of the ECONA™ CNS2135 ARM SOC solution for small form factor and low power network and storage applications.
  
  
• Sequans Introduces Second Chip in New Generation 65nm Mobile WiMAX Chip Family (Tuesday Jun. 02, 2009)
  Sequans Communications has introduced the SQN1220, the second chip in its new generation series of 65nm Mobile WiMAX system-on-chip (SOC) solutions. The new chip features a high level of processing power as needed to support combination voice and data applications and targets manufacturers of voice/data CPE and gateways with a solution that eliminates the need for an external CPU or DSP.