D&R Headline News | Most Popular | SoC News Alerts | |

Fabless / IDM News

• Broadcom Announces Groundbreaking 65 Nanometer Single-Chip Bluetooth 2.1 + EDR Solution for Mobile Handsets (Tuesday Jun. 03, 2008)
  Developed in a highly advanced 65 nanometer CMOS process, the new system-on-chip (SoC) solution targets mobile handset applications and includes the unique Broadcom® SmartAudio™ sound and voice enhancement technology that was previously available only in wireless headset products.
  
  
• STMicroelectronics Strengthens Position in Wireless Segment (Tuesday May. 27, 2008)
  STMicroelectronics today announced the intention of ST and EMP (Ericsson Mobile Platforms) to, within the existing partnership, also develop an analog baseband for a future high-volume EMP platform.
  
  
• NEC Electronics Introduces Cost-Effective EMMA SoCs with Built-In Support for Next-Generation H.264 Video Compression Standard (Monday May. 26, 2008)
  The new EMMA3SL/HD™ and EMMA3SL/SD™ devices enable users to build set-top boxes (STBs) and digital TVs (DTVs) with next-generation H.264 video compression standard, which offers twice the compression ratio as the current MPEG2 standard. The EMMA3SL/SD system-on-chip (SoC) supports standard-definition video broadcasts, while the EMMA3SL/HD SoC supports high-definition broadcasts.
  
  
• STMicroelectronics Introduces First 65nm SPEAr(R) Customizable Chip for Computer Peripherals Applications (Monday May. 26, 2008)
  ST's SPEAr (Structured Processor Enhanced Architecture) concept uniquely combines cost savings and shorter time-to-market of open-market standard products with the flexibility of application-specific ICs in optimizing system performance. Transfer of the SPEAr family to 65nm process technology yields increased density, performance and power-reduction features in new SPEAr devices.
  
  
• eSilicon Achieves Significant Milestone by Booking Production Orders from More Than Fifty Customers (Thursday May. 22, 2008)
  These orders cover devices in process technologies up to 90nm, addressing the communications, networking, storage, digital imaging, consumer and security markets.
  
  
• Conexant Launches World's First Family of Speakers-on-a-Chip Semiconductor Solutions (Monday May. 19, 2008)
  The CX20562 integrates key speaker technology and processing functionality into a single device, and is targeted at products that support high-definition audio and voice applications.
  
  
• ASOCS Unveils World's First Wireless MultiComm Processor (Monday May. 19, 2008)
  Revolutionary, Single-Chip to Boost Wireless Convergence, Enables Non-Stop Connectivity Across WiFi, Cellular, and HD Digital Television Networks
  
  
• K-micro and AnSem form a strategic partnership to develop chipsets for the home networking market (Wednesday May. 14, 2008)
  The first product that has been developed is an AFE (Analog Front End) chip that enables higher performance, lower cost home network devices
  
  
• Hynix - ProMOS Sign Amendment to Strengthen Long-term Strategic Alliance (Thursday May. 08, 2008)
  According to the Amendment, Hynix licenses to ProMOS 50 nanometer-class DRAM stack process technology, while ProMOS offers to Hynix such DRAM products from its 300mm fab capacity.
  
  
• Zilog Partners With ARM for New 32-Bit Microcontroller Solutions (Thursday May. 08, 2008)
  Zilog today announced it has extended its microcontroller (MCU) market strategy by licensing the ARM® Cortex(TM)-M3 processor to develop a new family of industry leading 32-bit based solutions
  
  
• ChipX Mixed-Signal ASIC Processes and Procedures Satisfy DO-254 Standard (Tuesday Apr. 22, 2008)
  ChipX Is Now Ready to Offer DO-254 Certification Support for Aerospace and Military ASIC Projects
  
  
• Legend Silicon Releases 3rd Generation DTV Demodulator Chip (Friday Apr. 18, 2008)
  With its industry-leading single-carrier and multi-carrier performance, the LGS-8G52 is the first and most ideal 2-in-1 chip solution on the Chinese DTV market.
  
  
• RC Module announces new SD/HD H.264 Decoder SoC aimed at Russian DVB market (Tuesday Apr. 15, 2008)
  RC Module announces its SD/HD H.264 Decoder SoC – a fully programmable highly integrated SD/HD set-top box decoder based on the ARM 1176JZF-S™ host CPU core, and highperformance stream co-processor based on NeuroMatrix® DSP technology.
  
  
• Gennum Delivers Low Power, PCI Express 2.0, Infiniband Repeater for System Interconnects (Monday Apr. 14, 2008)
  The low power, four-channel GN1406 device supports PCI Express (PCIe) 2.0 and Infiniband and combines the Gennum ClearEdge™ CDR and high-gain equalization technologies.
  
  
• Global Unichip Announces First Full Service SiP Production Flow in the Fabless ASIC Industry (Monday Apr. 14, 2008)
  With almost 10 million SiP shipment, GUC SiP service leads to a fast, low cost, and low risk way to realize products with high embedded memory requirements
  
  
• AMCC and Redpine Signals Collaborate on Next Generation Power Architecture-Based Embedded Wi-Fi Connectivity Solutions (Monday Apr. 14, 2008)
  Redpine's Lite-Fi(TM) product family offers best-in-class 802.11n with AMCC's PowerPC 405EX and EXr processors
  
  
• STMicroelectronics Achieves Highest Memory Density for ARM9 Standard MCUs, Delivering Pin- and Function Compatibility with Embedded Flash of 288 Kbytes to 2.1 Mbytes (Friday Apr. 11, 2008)
  STMicroelectronics has increased the on-chip Flash capacity of its STR91xFA ARM966E-S based MCU family by introducing 1.1 Mbyte and 2.1 Mbyte variants, delivering higher memory density than any other ARM9, or ARM7-TDMI, based standard MCU currently available.
  
  
• STMicroelectronics and NXP Merge Wireless Businesses to Expand Product Breadth and Boost Innovation (Friday Apr. 11, 2008)
  The new company will have the scale to better meet customer needs in 2G, 2.5G, 3G, multimedia, connectivity and all future wireless technologies.
  
  
• Gennum Delivers Industry's First Single-Chip HD and 3Gb/s Transmit and Receive Solutions (Monday Apr. 07, 2008)
  Gennum has developed the industry’s first single-chip transmit and receive solutions to support 3 gigabits per second (Gb/s), as well as high definition (HD) and standard definition (SD), for serial digital interface (SDI) applications.
  
  
• GCT Semiconductor Announces the Industry's First Single-Chip Solution Supporting Both Mobile WiMAX IEEE 802.16e Wave 2 and WiFi 802.11 b/g (Wednesday Apr. 02, 2008)
  GCT Semiconductor today announced the world's first highly integrated single-chip solution, GDM7215, supporting mobile WiMAX (IEEE 802.16e WAVE 2) and WiFi (802.11b/g). GDM7215 implements mobile WiMAX RF/MAC/PHY and WiFi RF/MAC/PHY on a monolithic die.
  
  
• Beceem Introduces World's First Single-Chip, 65 Nanometer Mobile WiMAX Solution - Sets New Standard for Low Power Consumption (Tuesday Apr. 01, 2008)
  The BCSM250 is Beceem’s 4th generation of WiMAX chips and the first WiMAX solution to combine a baseband processor, dual-band 2 GHz & 3 GHz radio, memory, power management unit and host interfaces based on 65 nanometer technology in a single chip
  
  
• STMicroelectronics, Intel and Francisco Partners Close Transaction to Create Numonyx (Monday Mar. 31, 2008)
  STMicroelectronics, together with Intel and Francisco Partners today announced the closing of their previously announced Numonyx joint venture
  
  
• QuickLogic Speeds Hard Disk Drive Transfers With New Proven System Block (Tuesday Mar. 25, 2008)
  QuickLogic has developed an UltraDMA (UDMA) system block for its Customer Specific Standard Product (CSSP) platforms. Created in conjunction with CSSP customers, the UDMA block speeds data transfers to mass storage while reducing system power requirements.
  
  
• Broadcom Demonstrates Industry's First Single-Chip High Definition Set-Top Box Solution With China AVS Support (Friday Mar. 21, 2008)
  The highly integrated system-on-a-chip (SoC) solution will enable set-top box manufacturers to rapidly design and deploy HD boxes compliant with China's new AVS specification.
  
  
• Spiral Gateway announces working test chip (Thursday Mar. 20, 2008)
  Spiral Gateway announces fully functional and validated samples of its RICA test chip; the Reconfigurable Instruction Cell Array (RICA) technology is targeted to meet the demands of image signal processing in the next generation of mobile phones.
  
  
• Jade Tech Announces multimedia SoC designed for portable and embedded application (Thursday Mar. 06, 2008)
  A100 is a highly integrated multimedia SoC designed for portable and embedded application. It integrates two ARM7TDMI cores and high performance complex FFT processor, as well as 512KB on-chip high speed memory which avoid the requirement for external memory devices.
  
  
• eSilicon Licenses Avago Technologies' High Performance Embedded SerDes Cores (Wednesday Feb. 27, 2008)
  eSilicon today announced that it has reached an agreement to license Avago Technologies' 90nm and 65nm embedded SerDes cores. The agreement allows eSilicon to offer these high performance cores as part of its custom chip development solution.
  
  
• Mobileye's System-on-Chip Delivers 2nd Generation Solution for Visual Recognition and Interpretation (Wednesday Feb. 27, 2008)
  EyeQ2™, Mobileye's System-on-Chip (SoC) delivers a 2nd generation solution for computationally intensive applications for real-time visual recognition and scene interpretation and has cabin-grade automotive qualification for use in intelligent vehicle systems
  
  
• Toshiba Launches New 32-Bit Microcontroller With ARM926EJ-S Processor (Tuesday Feb. 26, 2008)
  Based on an ARM926EJ-S CPU operating at up to 200 MHz, the new TMPA910CRAXBG features a built-in LCD controller with support for TFT and STN display resolutions up to 1024 by 768 pixels and an LCD data processor that provides image scaling, filtering and blending functions and offers real-time video processing for video at up to 30 frames per second.
  
  
• Fujitsu launches full HD multi-standard decoder device supporting both MPEG-2 and H.264 (Tuesday Feb. 26, 2008)
  Fujitsu Microelectronics Europe (FME) today announced the launch of a new full high-definition (HD) multi-standard video decoder device for DVB broadcasts, that decodes both MPEG-2 and H.264 compressed video up to full HD resolution (1920 dots x 1080 lines).